the layer connector connecting to a pin of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3216the layer connector connecting to a pin of the item

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Patents Grantslast 30 patents

Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard structure for signal isolation
- Patent number 9,991,209
- Issue date Jun 5, 2018
- Dunlin Tan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing element chip and method of manufacturing el...
- Patent number 9,698,052
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,736
- Issue date Jun 27, 2017
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,735
- Issue date Jun 27, 2017
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE POWER
- Publication number 20240321702
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP AND METHOD OF MANUFACTURING EL...
- Publication number 20170098590
- Publication date Apr 6, 2017
- Panasonic Intellectual Propery Management Co., Ltd
- ATSUSHI HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A GUARD STRUCTURE FOR SIGNAL ISOLATION
- Publication number 20160293554
- Publication date Oct 6, 2016
- Thales Solution Asia Pte Ltd.
- Dunlin TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME
- Publication number 20160035697
- Publication date Feb 4, 2016
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS