the layer connector connecting to a via metallisation of the item

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H01L2224/32165

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32165the layer connector connecting to a via metallisation of the item

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Patents Grantslast 30 patents

Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard structure for signal isolation
- Patent number 9,991,209
- Issue date Jun 5, 2018
- Dunlin Tan
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE POWER
- Publication number 20240321702
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A GUARD STRUCTURE FOR SIGNAL ISOLATION
- Publication number 20160293554
- Publication date Oct 6, 2016
- Thales Solution Asia Pte Ltd.
- Dunlin TAN
- H01 - BASIC ELECTRIC ELEMENTS