the layer connector covering only portions of the surface to be connected

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H01L2224/29034

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29034the layer connector covering only portions of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,491
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging methods using a photolithographic bonding mat...
- Patent number 10,755,979
- Issue date Aug 25, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates, assembles, and techniques to enable multi-chip flip chi...
- Patent number 10,748,873
- Issue date Aug 18, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC with solderable sidewalls
- Patent number 9,780,060
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuitry
- Patent number 9,666,573
- Issue date May 30, 2017
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die stacking for two or more die
- Patent number 9,640,515
- Issue date May 2, 2017
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die stacking for two or more die
- Patent number 9,312,244
- Issue date Apr 12, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,006,036
- Issue date Apr 14, 2015
- Renesas Electronics Corporation
- Tomoko Higashino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple die stacking for two or more die
- Patent number 8,952,516
- Issue date Feb 10, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including cap
- Patent number 8,946,877
- Issue date Feb 3, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package
- Patent number 8,698,300
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach composition for silicon chip placement on a flat substra...
- Patent number 8,657,413
- Issue date Feb 25, 2014
- Funai Electric Co., Ltd.
- David Graham
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Stacked semiconductor package
- Patent number 8,399,975
- Issue date Mar 19, 2013
- SK Hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered integrated circuit and apparatus with thermal managem...
- Patent number 8,349,650
- Issue date Jan 8, 2013
- HRL Laboratories, LLC
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for RFID tag
- Patent number 8,062,926
- Issue date Nov 22, 2011
- Fujitsu Limited
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layered integrated circuit and apparatus with thermal managem...
- Patent number 7,956,381
- Issue date Jun 7, 2011
- HRL Laboratories, LLC
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip packaging method for light emitting diode with eutectic l...
- Patent number 7,569,420
- Issue date Aug 4, 2009
- Huga Optotech Inc.
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip packaging structure for light emitting diode and method t...
- Patent number 7,408,204
- Issue date Aug 5, 2008
- Huga Optotech Inc.
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow flux and underfill dispensing methods
- Patent number 6,234,379
- Issue date May 22, 2001
- Nordson Corporation
- William E. Donges
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,959,363
- Issue date Sep 28, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074669
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...
- Publication number 20200135689
- Publication date Apr 30, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hu SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...
- Publication number 20180204821
- Publication date Jul 19, 2018
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20170084569
- Publication date Mar 23, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140080260
- Publication date Mar 20, 2014
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130127050
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Yuichi MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE STACKING FOR TWO OR MORE DIE
- Publication number 20130100616
- Publication date Apr 25, 2013
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130009304
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Ji-han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME
- Publication number 20120306095
- Publication date Dec 6, 2012
- Samsung Electronics Co., Ltd.
- KyuJin HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120292787
- Publication date Nov 22, 2012
- Hynix Semiconductor Inc.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
- Publication number 20120279651
- Publication date Nov 8, 2012
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRA...
- Publication number 20120182355
- Publication date Jul 19, 2012
- David Graham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic Apparatus Manufacturing Method, Electronic Component, an...
- Publication number 20120085575
- Publication date Apr 12, 2012
- Nobuhiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CAP
- Publication number 20120074555
- Publication date Mar 29, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
- Publication number 20110309057
- Publication date Dec 22, 2011
- TOUCH MICRO-SYSTEM TECHNOLOGY CORP.
- Hung Yi LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20110049707
- Publication date Mar 3, 2011
- Kabushiki Kaisha Toshiba
- Masaharu Seto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20100117244
- Publication date May 13, 2010
- NEC Electronics Corporation
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Packaging Structure For Light Emitting Diode And Method T...
- Publication number 20090124031
- Publication date May 14, 2009
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector covering only portions of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Semiconductor device packages and methods of manufacturing the same

Electronic component device

High reliability wafer level semiconductor packaging

Wafer-level packaging methods using a photolithographic bonding mat...

Substrates, assembles, and techniques to enable multi-chip flip chi...

High reliability wafer level semiconductor packaging

Method for the diffusion soldering of an electronic component to a...

High reliability wafer level semiconductor packaging

Method for bonding bare chip dies

Semiconductor device and production method therefor

Packaged IC with solderable sidewalls

Methods of forming integrated circuitry

Multiple die stacking for two or more die

Multiple die stacking for two or more die

Package structure and the method to manufacture thereof

Electronic device comprising at least a chip enclosed in a package...

Method of manufacturing semiconductor device

Multiple die stacking for two or more die

Semiconductor package including cap

Chip-stacked semiconductor package

Die attach composition for silicon chip placement on a flat substra...

Stacked semiconductor package

Multi-layered integrated circuit and apparatus with thermal managem...

Manufacturing method for RFID tag

Multi-layered integrated circuit and apparatus with thermal managem...

Flip-chip packaging method for light emitting diode with eutectic l...

Flip-chip packaging structure for light emitting diode and method t...

No-flow flux and underfill dispensing methods

Semiconductor device with improved encapsulating resin

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

CHIP-ON-FILM PACKAGE

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

WAFER-LEVEL PACKAGING METHODS USING A PHOTOLITHOGRAPHIC BONDING MAT...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Packaged IC With Solderable Sidewalls

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

Packaged IC with Solderable Sidewalls

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

MULTIPLE DIE STACKING FOR TWO OR MORE DIE

CHIP-STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME

STACKED SEMICONDUCTOR PACKAGE

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRA...

Electronic Apparatus Manufacturing Method, Electronic Component, an...

SEMICONDUCTOR PACKAGE INCLUDING CAP

LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor device and manufacturing method therefor

Flip-Chip Packaging Structure For Light Emitting Diode And Method T...