the layer connectors being bonded to at least one common bonding area

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H01L2224/33106

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/33106the layer connectors being bonded to at least one common bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,580,751
- Issue date Mar 3, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,529,681
- Issue date Jan 7, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,037,976
- Issue date Jul 31, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 9,793,244
- Issue date Oct 17, 2017
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous controlled depth hot embossing and active side protect...
- Patent number 9,780,014
- Issue date Oct 3, 2017
- HRL Laboratories, LLC
- Alexandros D. Margomenos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 9,711,630
- Issue date Jul 18, 2017
- Renesas Electronics Corporation
- Yasuyuki Yoshinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor element and a terminal...
- Patent number 9,306,046
- Issue date Apr 5, 2016
- Mitsubishi Electric Corporation
- Shigeo Toi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 8,787,033
- Issue date Jul 22, 2014
- Aisin Aw Co., Ltd.
- Hitoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...
- Publication number 20160293570
- Publication date Oct 6, 2016
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-FANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20120106116
- Publication date May 3, 2012
- AISIN AW CO., LTD.
- Hitoshi NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS

the layer connectors being bonded to at least one common bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Connection structure

Semiconductor device and manufacturing method thereof

Connection structure

Connection structure

Connection structure and method for manufacturing connection structure

Scalable package architecture and associated techniques and configu...

Connection structure and method for manufacturing connection structure

Electronic assembly with enhanced thermal dissipation

Scalable package architecture and associated techniques and configu...

Scalable package architecture and associated techniques and configu...

Simultaneous controlled depth hot embossing and active side protect...

Semiconductor device and an electronic device

Semiconductor device having a semiconductor element and a terminal...

Electronic component and electronic device

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

CONNECTION STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONNECTION STRUCTURE

CONNECTION STRUCTURE

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRI...

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE