the layer connectors being bonded to at least one common bonding area

Industry

CPC
H01L2224/3011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3011the layer connectors being bonded to at least one common bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,580,751
- Issue date Mar 3, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,529,681
- Issue date Jan 7, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES
- Publication number 20230387372
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20090267142
- Publication date Oct 29, 2009
- NEC ELECTRONICS CORPORATION
- Kinya OTANI
- H01 - BASIC ELECTRIC ELEMENTS

the layer connectors being bonded to at least one common bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure

Connection structure

Connection structure

Connection structure and method for manufacturing connection structure

Connection structure and method for manufacturing connection structure

Method for the diffusion soldering of an electronic component to a...

Patents Applicationslast 30 patents

DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES

CONNECTION STRUCTURE

CONNECTION STRUCTURE

CONNECTION STRUCTURE

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME