the mass being of clover leaf shape

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GPHYSICS G01Measuring instruments G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT

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G01P2015/0842the mass being of clover leaf shape

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Patents Grantslast 30 patents

Information Patent Grant
Inertial force sensor
- Patent number 10,345,329
- Issue date Jul 9, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirotsugu Suzuki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Micro electro mechanical systems sensor
- Patent number 10,336,605
- Issue date Jul 2, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Woon Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor and mounting structure of acceleration sensor
- Patent number 9,972,724
- Issue date May 15, 2018
- Denso Corporation
- Kiyomasa Sugimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angular velocity detection device and angular velocity sensor inclu...
- Patent number 9,835,641
- Issue date Dec 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kensaku Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Silicon wafer with a plurality of chip patterns
- Patent number 9,559,090
- Issue date Jan 31, 2017
- Dai Nippon Printing Co., Ltd.
- Tatsuro Takagaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dynamic quantity sensor
- Patent number 9,276,136
- Issue date Mar 1, 2016
- Dai Nippon Printing Co., Ltd.
- Katsumi Hashimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device manufacturing method and sensor device
- Patent number 9,209,319
- Issue date Dec 8, 2015
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angular velocity detection device and angular velocity sensor inclu...
- Patent number 9,164,119
- Issue date Oct 20, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kensaku Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device using a silicon wafer with a pattern arrangement
- Patent number 9,046,545
- Issue date Jun 2, 2015
- Dai Nippon Printing Co., Ltd.
- Tatsuro Takagaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor
- Patent number 8,739,628
- Issue date Jun 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong Woon Kim
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined inertial sensor devices
- Patent number 8,739,626
- Issue date Jun 3, 2014
- Fairchild Semiconductor Corporation
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined devices and fabricating the same
- Patent number 8,710,599
- Issue date Apr 29, 2014
- Fairchild Semiconductor Corporation
- David Lambe Marx
- G01 - MEASURING TESTING
Information Patent Grant
Acceleration sensor
- Patent number 6,920,788
- Issue date Jul 26, 2005
- Wacoh Corporation
- Kazuhiro Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor and manufacturing method for the same
- Patent number 6,772,632
- Issue date Aug 10, 2004
- Wacoh Corporation
- Kazuhiro Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ACCELERATION SENSOR AND MOUNTING STRUCTURE OF ACCELERATION SENSOR
- Publication number 20170345948
- Publication date Nov 30, 2017
- Kiyomasa SUGIMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20130283914
- Publication date Oct 31, 2013
- PANASONIC CORPORATION
- Takashi Imanaka
- G01 - MEASURING TESTING
Information Patent Application
INERTIAL SENSOR WITH STRESS ISOLATION STRUCTURE
- Publication number 20130139593
- Publication date Jun 6, 2013
- Hsieh-Shen Hsieh
- G01 - MEASURING TESTING
Information Patent Application
DYNAMIC QUANTITY SENSOR
- Publication number 20130113056
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Katsumi Hashimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE
- Publication number 20130113055
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANGULAR VELOCITY DETECTION DEVICE AND ANGULAR VELOCITY SENSOR INCLU...
- Publication number 20130091948
- Publication date Apr 18, 2013
- PANASONIC CORPORATION
- Kensaku Yamamoto
- G01 - MEASURING TESTING
Information Patent Application
ACCELERATION SENSOR
- Publication number 20120255358
- Publication date Oct 11, 2012
- PANASONIC CORPORATION
- Takashi IMANAKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR
- Publication number 20120152020
- Publication date Jun 21, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Woon Kim
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
- Publication number 20120133042
- Publication date May 31, 2012
- Panasonic Electric Works Co., Ltd.
- Shintarou Hayashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Sensor Package
- Publication number 20120056280
- Publication date Mar 8, 2012
- Ming-Ching WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PATTERN ARRANGEMENT METHOD, SILICON WAFER AND SEMICONDUCTOR DEVICE
- Publication number 20110140214
- Publication date Jun 16, 2011
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Takagaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED INERTIAL SENSOR DEVICES
- Publication number 20110030473
- Publication date Feb 10, 2011
- Cenk Acar
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED DEVICES AND FABRICATING THE SAME
- Publication number 20110031565
- Publication date Feb 10, 2011
- David Lambe Marx
- G01 - MEASURING TESTING
Information Patent Application
Acceleration sensor and manufacturing method for the same
- Publication number 20040231422
- Publication date Nov 25, 2004
- WACOH CORPORATION
- Kazuhiro Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Acceleration sensor and manufacturing method for the same
- Publication number 20030209075
- Publication date Nov 13, 2003
- WACOH CORPORATION
- Kazuhiro Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the mass being of clover leaf shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inertial force sensor

Micro electro mechanical systems sensor

Acceleration sensor and mounting structure of acceleration sensor

Angular velocity detection device and angular velocity sensor inclu...

Silicon wafer with a plurality of chip patterns

Dynamic quantity sensor

Sensor device manufacturing method and sensor device

Angular velocity detection device and angular velocity sensor inclu...

Semiconductor device using a silicon wafer with a pattern arrangement

Inertial sensor

Micromachined inertial sensor devices

Micromachined devices and fabricating the same

Acceleration sensor

Acceleration sensor and manufacturing method for the same

Patents Applicationslast 30 patents

ACCELERATION SENSOR AND MOUNTING STRUCTURE OF ACCELERATION SENSOR

ACCELERATION SENSOR

INERTIAL SENSOR WITH STRESS ISOLATION STRUCTURE

DYNAMIC QUANTITY SENSOR

SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE

ANGULAR VELOCITY DETECTION DEVICE AND ANGULAR VELOCITY SENSOR INCLU...

ACCELERATION SENSOR

INERTIAL SENSOR

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

MEMS Sensor Package

PATTERN ARRANGEMENT METHOD, SILICON WAFER AND SEMICONDUCTOR DEVICE

MICROMACHINED INERTIAL SENSOR DEVICES

MICROMACHINED DEVICES AND FABRICATING THE SAME

Acceleration sensor and manufacturing method for the same

Acceleration sensor and manufacturing method for the same