the material being a silicon carbide not containing oxygen

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02167the material being a silicon carbide not containing oxygen

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Patents Grantslast 30 patents

Information Patent Grant
Contact over active gate structures with etch stop layers for advan...
- Patent number 12,261,122
- Issue date Mar 25, 2025
- Intel Corporation
- Atul Madhavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,398
- Issue date Feb 25, 2025
- United Microelectronics Corp.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional field effect device
- Patent number 12,237,325
- Issue date Feb 25, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including insulation patterns with different...
- Patent number 12,237,385
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Bongkwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organoaminosilane precursors and methods for depositing films compr...
- Patent number 12,230,496
- Issue date Feb 18, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-term implantable electronic devices
- Patent number 12,220,239
- Issue date Feb 11, 2025
- Northwestern University
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,217,959
- Issue date Feb 4, 2025
- Kokusai Electric Corporation
- Kimihiko Nakatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain feature separation structure
- Patent number 12,178,032
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on carbon composition and method of manufacturing a semiconduc...
- Patent number 12,148,610
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam removal in high aspect ratio gap-fill
- Patent number 12,142,480
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs and methods of forming FinFETs
- Patent number 12,087,861
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gas spacers and method of manufacture
- Patent number 12,068,389
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC edge ring
- Patent number 12,062,568
- Issue date Aug 13, 2024
- Tokai Carbon Korea Co., Ltd.
- Kyoung Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming method and film forming apparatus
- Patent number 12,060,641
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Hirokazu Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate-all-around (GAA) method and devices
- Patent number 12,057,485
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic devices comprising silicon carbide ma...
- Patent number 12,027,363
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Silicon-carbide-on-insulator via photoelectrochemical etching
- Patent number 11,996,285
- Issue date May 28, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Daniil M. Lukin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for deposition of low-k films
- Patent number 11,990,332
- Issue date May 21, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Connection between source/drain and gate
- Patent number 11,980,016
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with inner spacer layer and method f...
- Patent number 11,973,129
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF IDENTIFYING DEFECTS IN CRYSTALS
- Publication number 20250093240
- Publication date Mar 20, 2025
- GLOBALWAFERS CO., LTD.
- YewChung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opaque Thermal Layer for Silicon Carbide Substrates
- Publication number 20250079186
- Publication date Mar 6, 2025
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE-ION DEPOSITION PROCESSES FOR DIELECTRIC MATERIAL FORMATION
- Publication number 20250046602
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL
- Publication number 20250037996
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...
- Publication number 20250037987
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Stephen Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...
- Publication number 20250014895
- Publication date Jan 9, 2025
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP
- Publication number 20250006489
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMING A PLANAR SEMICONDUCTOR SURFACE
- Publication number 20240429041
- Publication date Dec 26, 2024
- The Boeing Company
- Shanying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME
- Publication number 20240420951
- Publication date Dec 19, 2024
- FENG CHIA UNIVERSITY
- Chang-Ho YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20240395539
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Hong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240379347
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Mikko Ruoho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS
- Publication number 20240363337
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES
- Publication number 20240355896
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20240347465
- Publication date Oct 17, 2024
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...
- Publication number 20240332001
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY
- Publication number 20240332005
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Wenhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS
- Publication number 20240332002
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20240297069
- Publication date Sep 5, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONNECTION BETWEEN SOURCE/DRAIN AND GATE
- Publication number 20240292592
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240290611
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...
- Publication number 20240263348
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240249942
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240249947
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE FILL FOR SILICON GAP FILL PROCESSES
- Publication number 20240234128
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Taiki Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER
- Publication number 20240234549
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING SILICON-BASED MATERIAL AND PRECURSORS FOR THE...
- Publication number 20240203727
- Publication date Jun 20, 2024
- ASM IP HOLDING B.V.
- Tao Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240162333
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...
- Publication number 20240162079
- Publication date May 16, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Miao-Syuan Fan
- H01 - BASIC ELECTRIC ELEMENTS

the material being a silicon carbide not containing oxygen

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact over active gate structures with etch stop layers for advan...

Semiconductor device and method for fabricating the same

Three-dimensional field effect device

Semiconductor devices including insulation patterns with different...

Organoaminosilane precursors and methods for depositing films compr...

Metal-insulator-metal structure

Air gap spacer formation for nano-scale semiconductor devices

Long-term implantable electronic devices

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device with multi-layer etch stop structure

Dielectric capping structure overlying a conductive structure to in...

Source/drain feature separation structure

Methods for etching a material layer for semiconductor applications

Spin on carbon composition and method of manufacturing a semiconduc...

Seam removal in high aspect ratio gap-fill

Method of deposition

FinFETs and methods of forming FinFETs

Patterning methods for semiconductor devices

Semiconductor device including gas spacers and method of manufacture

SiC edge ring

Film forming method and film forming apparatus

Gate-all-around (GAA) method and devices

Methods of forming electronic devices comprising silicon carbide ma...

Silicon-carbide-on-insulator via photoelectrochemical etching

Methods and apparatus for deposition of low-k films

Connection between source/drain and gate

Semiconductor device structure with inner spacer layer and method f...

Systems and methods for depositing low-k dielectric films

Semiconductor device and method

Device of dielectric layer

Patents Applicationslast 30 patents

METHOD OF IDENTIFYING DEFECTS IN CRYSTALS

Opaque Thermal Layer for Silicon Carbide Substrates

REACTIVE-ION DEPOSITION PROCESSES FOR DIELECTRIC MATERIAL FORMATION

SEAM REMOVAL IN HIGH ASPECT RATIO GAP-FILL

METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...

METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

FORMING A PLANAR SEMICONDUCTOR SURFACE

SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME

SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...

METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY

ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS

COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...

CONNECTION BETWEEN SOURCE/DRAIN AND GATE

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...

SEMICONDUCTOR DEVICE AND METHOD

DEVICE OF DIELECTRIC LAYER

DIRECTIONAL SELECTIVE FILL FOR SILICON GAP FILL PROCESSES

SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER

METHOD OF DEPOSITING SILICON-BASED MATERIAL AND PRECURSORS FOR THE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...