the material being a silicon carbide not containing oxygen

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02167the material being a silicon carbide not containing oxygen

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Patents Grantslast 30 patents

Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin on carbon composition and method of manufacturing a semiconduc...
- Patent number 12,148,610
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam removal in high aspect ratio gap-fill
- Patent number 12,142,480
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qinghua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs and methods of forming FinFETs
- Patent number 12,087,861
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hsiang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning methods for semiconductor devices
- Patent number 12,074,058
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including gas spacers and method of manufacture
- Patent number 12,068,389
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC edge ring
- Patent number 12,062,568
- Issue date Aug 13, 2024
- Tokai Carbon Korea Co., Ltd.
- Kyoung Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film forming method and film forming apparatus
- Patent number 12,060,641
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Hirokazu Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate-all-around (GAA) method and devices
- Patent number 12,057,485
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic devices comprising silicon carbide ma...
- Patent number 12,027,363
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Silicon-carbide-on-insulator via photoelectrochemical etching
- Patent number 11,996,285
- Issue date May 28, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Daniil M. Lukin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for deposition of low-k films
- Patent number 11,990,332
- Issue date May 21, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Connection between source/drain and gate
- Patent number 11,980,016
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with inner spacer layer and method f...
- Patent number 11,973,129
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,916,132
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,908,921
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 11,894,227
- Issue date Feb 6, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with multi-layer etch stop...
- Patent number 11,848,231
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped or undoped silicon carbide deposition and remote hydrogen pla...
- Patent number 11,848,199
- Issue date Dec 19, 2023
- Lam Research Corporation
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-Insulator-Metal structure
- Patent number 11,842,959
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation features and methods of fabricating the same
- Patent number 11,843,028
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, method of processing...
- Patent number 11,823,886
- Issue date Nov 21, 2023
- Kokusai Electric Corporation
- Kazuhiro Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nano multilayer carbon-rich low-k spacer
- Patent number 11,791,398
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Donald Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 11,784,044
- Issue date Oct 10, 2023
- Kokusai Electric Corporation
- Takeo Hanashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME
- Publication number 20240420951
- Publication date Dec 19, 2024
- FENG CHIA UNIVERSITY
- Chang-Ho YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...
- Publication number 20240395539
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Hong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240379347
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Mikko Ruoho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS
- Publication number 20240363337
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES
- Publication number 20240355896
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20240347465
- Publication date Oct 17, 2024
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...
- Publication number 20240332001
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY
- Publication number 20240332005
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Wenhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS
- Publication number 20240332002
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20240297069
- Publication date Sep 5, 2024
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONNECTION BETWEEN SOURCE/DRAIN AND GATE
- Publication number 20240292592
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240290611
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...
- Publication number 20240263348
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240249942
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240249947
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE FILL FOR SILICON GAP FILL PROCESSES
- Publication number 20240234128
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Taiki Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER
- Publication number 20240234549
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING SILICON-BASED MATERIAL AND PRECURSORS FOR THE...
- Publication number 20240203727
- Publication date Jun 20, 2024
- ASM IP HOLDING B.V.
- Tao Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240162333
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...
- Publication number 20240162079
- Publication date May 16, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Miao-Syuan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240162084
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240162036
- Publication date May 16, 2024
- ASM IP HOLDING B.V.
- Viraj Madhiwala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240145233
- Publication date May 2, 2024
- Kokusai Electric Corporation
- Daigo YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
- Publication number 20240079266
- Publication date Mar 7, 2024
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240071748
- Publication date Feb 29, 2024
- ASM IP HOLDING B.V.
- SangHeon Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL
- Publication number 20240071773
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Lei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...
- Publication number 20240063015
- Publication date Feb 22, 2024
- LAM RESEARCH CORPORATION
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the material being a silicon carbide not containing oxygen

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for etching a material layer for semiconductor applications

Spin on carbon composition and method of manufacturing a semiconduc...

Seam removal in high aspect ratio gap-fill

Method of deposition

FinFETs and methods of forming FinFETs

Patterning methods for semiconductor devices

Semiconductor device including gas spacers and method of manufacture

SiC edge ring

Film forming method and film forming apparatus

Gate-all-around (GAA) method and devices

Methods of forming electronic devices comprising silicon carbide ma...

Silicon-carbide-on-insulator via photoelectrochemical etching

Methods and apparatus for deposition of low-k films

Connection between source/drain and gate

Semiconductor device structure with inner spacer layer and method f...

Systems and methods for depositing low-k dielectric films

Semiconductor device and method

Device of dielectric layer

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor device and method of manufacture

Transistor isolation structures

Conformal deposition of silicon carbide films

Semiconductor structure with an air gap

Method for forming semiconductor device with multi-layer etch stop...

Doped or undoped silicon carbide deposition and remote hydrogen pla...

Metal-Insulator-Metal structure

Isolation features and methods of fabricating the same

Method of manufacturing semiconductor device, method of processing...

Nano multilayer carbon-rich low-k spacer

Method of processing substrate, method of manufacturing semiconduct...

Patents Applicationslast 30 patents

SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME

SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUC...

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...

METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY

ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS

COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, AND SEMICONDUCT...

CONNECTION BETWEEN SOURCE/DRAIN AND GATE

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

DEFORMATION COMPENSATION METHOD FOR GROWING THICK GALIUM NITRIDE ON...

SEMICONDUCTOR DEVICE AND METHOD

DEVICE OF DIELECTRIC LAYER

DIRECTIONAL SELECTIVE FILL FOR SILICON GAP FILL PROCESSES

SEMICONDUCTOR DEVICE STRUCTURE WITH INNER SPACER LAYER

METHOD OF DEPOSITING SILICON-BASED MATERIAL AND PRECURSORS FOR THE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIO...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND NITROGEN

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES

SUBSTRATE PROCESSING METHOD

ION IMPLANTATION FOR INCREASED ADHESION WITH RESIST MATERIAL

DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...