the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0212the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor and a semiconductor device
- Patent number 11,973,144
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cyclic plasma processing
- Patent number 11,961,735
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching solution and method for selectively removing silicon nitrid...
- Patent number 11,955,341
- Issue date Apr 9, 2024
- VERSUM MATERIALS US, LLC
- Jhih Kuei Ge
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,952,664
- Issue date Apr 9, 2024
- Kokusai Electric Corporation
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silyl pseudohalides for silicon containing films
- Patent number 11,932,940
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Keenan N. Woods
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,923,193
- Issue date Mar 5, 2024
- Kokusai Electric Corporation
- Kimihiko Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,923,188
- Issue date Mar 5, 2024
- Kokusai Electric Corporation
- Takeo Hanashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,923,433
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,915,925
- Issue date Feb 27, 2024
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,915,976
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hard mask structure with repeating s...
- Patent number 11,901,187
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hwanyeol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-free approach for forming contact plugs
- Patent number 11,901,229
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 11,894,227
- Issue date Feb 6, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
FinFET device having oxide region between vertical fin structures
- Patent number 11,894,275
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 11,885,016
- Issue date Jan 30, 2024
- Kokusai Electric Corporation
- Kazuhiro Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stress patterning systems and methods for manufacturing free-form d...
- Patent number 11,879,170
- Issue date Jan 23, 2024
- Massachusetts Institute of Technology
- Youwei Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trench isolation layer and method of...
- Patent number 11,854,864
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Juyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,854,766
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with gate spacer
- Patent number 11,854,796
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Yao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing substrate and manufacturing semiconductor dev...
- Patent number 11,848,203
- Issue date Dec 19, 2023
- Kokusai Electric Corporation
- Takayuki Waseda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor device with multi-layer etch stop...
- Patent number 11,848,231
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped or undoped silicon carbide deposition and remote hydrogen pla...
- Patent number 11,848,199
- Issue date Dec 19, 2023
- Lam Research Corporation
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 11,837,515
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor spacer structures
- Patent number 11,830,931
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chansyun David Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
- Publication number 20240145230
- Publication date May 2, 2024
- Applied Materials, Inc.
- Abhishek Mandal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20240136226
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...
- Publication number 20240120195
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Keith T. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIAL
- Publication number 20240120193
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Shankar Venkataraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS...
- Publication number 20240113039
- Publication date Apr 4, 2024
- Intel Corporation
- Tayseer Mahdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240112907
- Publication date Apr 4, 2024
- Kokusai Electric Corporation
- Shoma MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...
- Publication number 20240107771
- Publication date Mar 28, 2024
- Infineon Technologies LLC
- Michael ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105448
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Motomu DEGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105443
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF SELF-ASSEMBLED MONOLAYER FOR SELECTIVE ETCHING PROCESS
- Publication number 20240105462
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240087880
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Shruba Gangopadhyay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240087881
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Michael Haverty
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
- Publication number 20240079266
- Publication date Mar 7, 2024
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC Bias in Plasma Process
- Publication number 20240071722
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reducing Loss of Dielectric Layer in IO Silicon Oxide Re...
- Publication number 20240071760
- Publication date Feb 29, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhenquan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, MET...
- Publication number 20240071752
- Publication date Feb 29, 2024
- Kokusai Electric Corporation
- Takayuki WASEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...
- Publication number 20240063015
- Publication date Feb 22, 2024
- LAM RESEARCH CORPORATION
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
- Publication number 20240057335
- Publication date Feb 15, 2024
- Lodestar Licensing Group LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Depositing SiCON with C, O, and N Compositional Control
- Publication number 20240047193
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING TREATED SILICON-CARBON MATERIAL
- Publication number 20240047198
- Publication date Feb 8, 2024
- ASM IP HOLDING B.V.
- Hirotsugu Sugiura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING VIAS WITH PULSING PLASMA
- Publication number 20240047221
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING FILMS WITH IMPROVED FILM QUALITY
- Publication number 20240038527
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20240038539
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240030026
- Publication date Jan 25, 2024
- Kokusai Electric Corporation
- Shoma MIYATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021668
- Publication date Jan 18, 2024
- Japan Display Inc.
- Hajime WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240014034
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS

the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor and a semiconductor device

Systems and methods for depositing low-k dielectric films

Cyclic plasma processing

Etching solution and method for selectively removing silicon nitrid...

Substrate processing apparatus and method of manufacturing semicond...

Device of dielectric layer

Silyl pseudohalides for silicon containing films

Methods of manufacturing an integrated circuit having stress tuning...

Method of manufacturing semiconductor device, substrate processing...

Method of manufacturing semiconductor device, substrate processing...

Fin field-effect transistor and method of forming the same

Semiconductor device manufacturing method

Semiconductor device pre-cleaning

Dielectric film for semiconductor fabrication

Semiconductor device including hard mask structure with repeating s...

Barrier-free approach for forming contact plugs

Conformal deposition of silicon carbide films

FinFET device having oxide region between vertical fin structures

Method of processing substrate, method of manufacturing semiconduct...

Stress patterning systems and methods for manufacturing free-form d...

Multi-layer line structure and method for manufacturing thereof

Semiconductor device including trench isolation layer and method of...

DC bias in plasma process

Semiconductor device structure with gate spacer

Semiconductor device with a passivation layer and method for produc...

Methods of processing substrate and manufacturing semiconductor dev...

Method for forming semiconductor device with multi-layer etch stop...

Doped or undoped silicon carbide deposition and remote hydrogen pla...

Semiconductor device and method

Transistor spacer structures

Patents Applicationslast 30 patents

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

Substrate with Differing Dielectric Constants

Barrier-Free Approach for Forming Contact Plugs

SEMICONDUCTOR DEVICE PRE-CLEANING

DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...

CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIAL

BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

FORMATION OF SELF-ASSEMBLED MONOLAYER FOR SELECTIVE ETCHING PROCESS

MULTI-LAYER LINE STRUCTURE

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES

DC Bias in Plasma Process

Method for Reducing Loss of Dielectric Layer in IO Silicon Oxide Re...

METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, MET...

DOPED OR UNDOPED SILICON CARBIDE DEPOSITION AND REMOTE HYDROGEN PLA...

INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES

Methods of Depositing SiCON with C, O, and N Compositional Control

METHOD OF FORMING TREATED SILICON-CARBON MATERIAL

METHOD OF MANUFACTURING VIAS WITH PULSING PLASMA

FORMING FILMS WITH IMPROVED FILM QUALITY

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME