the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0212the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Air gap spacer formation for nano-scale semiconductor devices
- Patent number 12,224,203
- Issue date Feb 11, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing vias with pulsing plasma
- Patent number 12,224,178
- Issue date Feb 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain regions of FinFET devices and methods of forming same
- Patent number 12,218,240
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation process
- Patent number 12,217,999
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 12,217,936
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 12,198,925
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,191,140
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Yutaka Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxynitride based encapsulation layer for magnetic tunnel ju...
- Patent number 12,185,641
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Vignesh Sundar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 12,183,639
- Issue date Dec 31, 2024
- SK keyfoundry Inc.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,183,579
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a silicon carbide device
- Patent number 12,176,207
- Issue date Dec 24, 2024
- X-FAB TEXAS, INC.
- Daniel Mauch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 12,176,206
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain feature separation structure
- Patent number 12,178,032
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide layer for oxidation resistance and method forming same
- Patent number 12,148,652
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential plasma and thermal treatment
- Patent number 12,142,475
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,142,668
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching with fluorine, oxygen and noble gas containing pl...
- Patent number 12,131,914
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and substrate process...
- Patent number 12,131,947
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Yutaka Motoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,901
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Makoto Shimosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,703
- Issue date Oct 22, 2024
- Renesas Electronics Corporation
- Shibun Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of area-selective deposition and method of fabricating an el...
- Patent number 12,116,667
- Issue date Oct 15, 2024
- SK Hynix Inc.
- Woo-Hee Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming film and processing apparatus
- Patent number 12,112,943
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Keita Kumagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for sealing a seam, semiconductor structure, and method for...
- Patent number 12,094,768
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONCURRENT OR CYCLICAL ETCH AND DIRECTIONAL DEPOSITION
- Publication number 20250046601
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Morgan EVANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEQUENTIAL PLASMA AND THERMAL TREATMENT
- Publication number 20250037989
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20250014904
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...
- Publication number 20250014895
- Publication date Jan 9, 2025
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE DEVICE
- Publication number 20250006814
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang LEHNERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP
- Publication number 20250006489
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...
- Publication number 20250006488
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- Chao-Hsiu LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240429042
- Publication date Dec 26, 2024
- CXMT Corporation
- Yihang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240405096
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240404802
- Publication date Dec 5, 2024
- Kokusai Electric Corporation
- Atsushi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
- Publication number 20240395541
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Manchao Xiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PLASMA ETCHING
- Publication number 20240395560
- Publication date Nov 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih Pin KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395902
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME
- Publication number 20240387238
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240379347
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Mikko Ruoho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Channel Devices and Method with Anti-Punch Through Process
- Publication number 20240379816
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material For Forming Organic Film, Substrate For Manufacturing Semi...
- Publication number 20240363335
- Publication date Oct 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240363338
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...
- Publication number 20240347465
- Publication date Oct 17, 2024
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K ALD GAP-FILL METHODS AND MATERIAL
- Publication number 20240347337
- Publication date Oct 17, 2024
- LAM RESEARCH CORPORATION
- Joseph R. Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR DEPOSITING SIB FILMS
- Publication number 20240339316
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Aykut AYDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240339331
- Publication date Oct 10, 2024
- UNITED MICROELECTRONICS CORP.
- Chung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...
- Publication number 20240339359
- Publication date Oct 10, 2024
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SILICON-CONTAINING MATERIALS WITH INCREASED ELECTRICAL, MECHA...
- Publication number 20240332000
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Akhil Singhal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20240304438
- Publication date Sep 12, 2024
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Air gap spacer formation for nano-scale semiconductor devices

Method of manufacturing vias with pulsing plasma

Source/drain regions of FinFET devices and methods of forming same

Trench isolation process

DC bias in plasma process

Systems and methods for depositing low-k dielectric films

Semiconductor device with multi-layer etch stop structure

Method for manufacturing semiconductor device and substrate process...

Silicon oxynitride based encapsulation layer for magnetic tunnel ju...

Semiconductor device having deep trench structure and method of man...

Method for manufacturing semiconductor device

Method for manufacturing a silicon carbide device

Varying temperature anneal for film and structures formed thereby

Source/drain feature separation structure

Metal oxide composite as etch stop layer

Cyclic spin-on coating process for forming dielectric material

Methods for etching a material layer for semiconductor applications

Silicon oxide layer for oxidation resistance and method forming same

Sequential plasma and thermal treatment

Semiconductor device and method

Selective etching with fluorine, oxygen and noble gas containing pl...

Method for manufacturing semiconductor device and substrate process...

Selective processing with etch residue-based inhibitors

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of area-selective deposition and method of fabricating an el...

Method for forming film and processing apparatus

Selective liquid sliding surface and method of fabricating the same

Selective silicon deposition

Method for sealing a seam, semiconductor structure, and method for...

Patents Applicationslast 30 patents

CONCURRENT OR CYCLICAL ETCH AND DIRECTIONAL DEPOSITION

SEQUENTIAL PLASMA AND THERMAL TREATMENT

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...

SILICON CARBIDE DEVICE

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...

METHOD OF PLASMA ETCHING

SEMICONDUCTOR DEVICE AND METHOD

SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME

DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

Multi-Channel Devices and Method with Anti-Punch Through Process

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

Material For Forming Organic Film, Substrate For Manufacturing Semi...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVAN...

LOW-K ALD GAP-FILL METHODS AND MATERIAL

PROCESSES FOR DEPOSITING SIB FILMS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...

DOPED SILICON-CONTAINING MATERIALS WITH INCREASED ELECTRICAL, MECHA...

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...