the material containing at least one metal element

Industry

CPC
H01L21/02172

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02172the material containing at least one metal element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices including vertical transistors, and related methods
- Patent number 11,973,145
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,961,918
- Issue date Apr 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka Nakazawa
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Selective deposition of barrier layer
- Patent number 11,948,834
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-driven transition from insulator to conductor
- Patent number 11,923,245
- Issue date Mar 5, 2024
- Bowling Green State University
- Farida Selim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator with crystalline silicon oxide
- Patent number 11,923,236
- Issue date Mar 5, 2024
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with low threshold voltage
- Patent number 11,901,241
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gaps and method of fabrication thereof
- Patent number 11,830,769
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reagents to remove oxygen from metal oxyhalide precursors in thin f...
- Patent number 11,821,080
- Issue date Nov 21, 2023
- L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Geo...
- Yumin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective layer formation using deposition and removing
- Patent number 11,804,373
- Issue date Oct 31, 2023
- ASM IP Holding, B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor feature and method for manufacturing the same
- Patent number 11,764,103
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective passivation layer for magnetic tunnel junctions
- Patent number 11,758,820
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jodi Mari Iwata
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having a multi-layer diffusion barrier and met...
- Patent number 11,742,393
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a photoresist underlayer and structure including...
- Patent number 11,735,422
- Issue date Aug 22, 2023
- ASM IP Holding B.V.
- Ivan Zyulkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal oxynitride film
- Patent number 11,728,163
- Issue date Aug 15, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuki Tanemura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,715,636
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing blocking layers on conductive surfaces
- Patent number 11,702,733
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electrodes over oxide semiconductor
- Patent number 11,688,602
- Issue date Jun 27, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Obtaining a clean nitride surface by annealing
- Patent number 11,688,601
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Aakash Pushp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,677,010
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,664,281
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hui Chang Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,646,193
- Issue date May 9, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boron nitride layer, apparatus including the same, and method of fa...
- Patent number 11,624,127
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Changseok Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Manufacturing of foreign oxide or foreign nitride on semiconductor
- Patent number 11,615,952
- Issue date Mar 28, 2023
- TURUN YLIOPISTO
- Mikhail Kuzmin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment for adhesion improvement
- Patent number 11,594,410
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,587,785
- Issue date Feb 21, 2023
- Japan Display Inc.
- Yoshikatsu Imazeki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Deposition of semiconductor integration films
- Patent number 11,562,904
- Issue date Jan 24, 2023
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 11,527,402
- Issue date Dec 13, 2022
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming contact holes using litho-etch-litho-etch approach
- Patent number 11,515,159
- Issue date Nov 29, 2022
- United Microelectronics Corp.
- Ching-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride sintered body and member for semiconductor manufac...
- Patent number 11,508,586
- Issue date Nov 22, 2022
- MiCo Ceramics Ltd.
- Je Ho Chae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID OXYGEN IONIC CONDUCTOR BASED FIELD-EFFECT TRANSISTOR AND METH...
- Publication number 20240088240
- Publication date Mar 14, 2024
- UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
- Xianhui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING...
- Publication number 20230420256
- Publication date Dec 28, 2023
- ASM IP HOLDING B.V.
- Ivan Zyulkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING METAL OXYNITRIDE FILM
- Publication number 20230402280
- Publication date Dec 14, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Kazuki TANEMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device with Air Gaps and Method of Fabrication Thereof
- Publication number 20230386905
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS
- Publication number 20230386839
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230377945
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE PASSIVATION LAYER FOR MAGNETIC TUNNEL JUNCTIONS
- Publication number 20230371395
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jodi Mari Iwata
- G11 - INFORMATION STORAGE
Information Patent Application
Method for Manufacturing Ferromagnetic-Dielectric Composite Material
- Publication number 20230343602
- Publication date Oct 26, 2023
- Ferric Inc.
- Michael Lekas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...
- Publication number 20230326737
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230326741
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING BLOCKING LAYERS ON CONDUCTIVE SURFACES
- Publication number 20230295794
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BORON NITRIDE LAYER, APPARATUS INCLUDING THE SAME, AND METHOD OF FA...
- Publication number 20230272554
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Changseok LEE
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20230268418
- Publication date Aug 24, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY , LTD.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT
- Publication number 20230223274
- Publication date Jul 13, 2023
- CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
- Marc L. Tarabbia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment for Adhesion Improvement
- Publication number 20230187201
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS
- Publication number 20230127535
- Publication date Apr 27, 2023
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230094053
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Yuichiro WAGATSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...
- Publication number 20230098746
- Publication date Mar 30, 2023
- Kokusai Electric Corporation
- Yoshimasa NAGATOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTOR
- Publication number 20230101586
- Publication date Mar 30, 2023
- Bowling Green State University
- Farida Selim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR PRODUCING A CRYSTALLINE OXIDE SEMICONDUCTOR FILM AND A...
- Publication number 20230089169
- Publication date Mar 23, 2023
- Shin-Etsu Chemical Co., Ltd.
- Takenori WATABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20230067218
- Publication date Mar 2, 2023
- Kokusai Electric Corporation
- Yoshitomo HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM NITRIDE SINTERED BODY AND MEMBER FOR SEMICONDUCTOR MANUFAC...
- Publication number 20230024625
- Publication date Jan 26, 2023
- MiCo Ceramics Ltd.
- Je Ho CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER FORMATION USING DEPOSITION AND REMOVING
- Publication number 20230016537
- Publication date Jan 19, 2023
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT WITH A DIELECTRIC PASSIVATION STACK
- Publication number 20230020337
- Publication date Jan 19, 2023
- GENERAL ELECTRIC COMPANY
- Cheng-Po Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR WITH CRYSTALLINE SILICON OXIDE
- Publication number 20230005786
- Publication date Jan 5, 2023
- TURUN YLIOPISTO
- Pekka LAUKKANEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, RAW MATERIAL CARTRIDGE, SUBSTRATE P...
- Publication number 20220411929
- Publication date Dec 29, 2022
- TOKYO ELECTRON LIMITED
- Muneo HARADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220406944
- Publication date Dec 22, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220384635
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20220367646
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YAO-WEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS

the material containing at least one metal element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices including vertical transistors, and related methods

Semiconductor device and method for manufacturing semiconductor device

Selective deposition of barrier layer

Light-driven transition from insulator to conductor

Silicon-on-insulator with crystalline silicon oxide

Integrated circuit device with low threshold voltage

Semiconductor device with air gaps and method of fabrication thereof

Reagents to remove oxygen from metal oxyhalide precursors in thin f...

Selective layer formation using deposition and removing

Method of forming copper interconnect structure with manganese barr...

Semiconductor feature and method for manufacturing the same

Protective passivation layer for magnetic tunnel junctions

Semiconductor device having a multi-layer diffusion barrier and met...

Method of forming a photoresist underlayer and structure including...

Method for manufacturing metal oxynitride film

Method of manufacturing a semiconductor device

Methods for depositing blocking layers on conductive surfaces

Semiconductor device with electrodes over oxide semiconductor

Obtaining a clean nitride surface by annealing

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device

Manufacturing of foreign oxide or foreign nitride on semiconductor

Boron nitride layer, apparatus including the same, and method of fa...

Manufacturing of foreign oxide or foreign nitride on semiconductor

Treatment for adhesion improvement

Electronic apparatus

Deposition of semiconductor integration films

Method of processing substrate, substrate processing apparatus, rec...

Forming contact holes using litho-etch-litho-etch approach

Aluminum nitride sintered body and member for semiconductor manufac...

Patents Applicationslast 30 patents

SOLID OXYGEN IONIC CONDUCTOR BASED FIELD-EFFECT TRANSISTOR AND METH...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

METHOD OF FORMING A PHOTORESIST UNDERLAYER AND STRUCTURE INCLUDING...

METHOD FOR MANUFACTURING METAL OXYNITRIDE FILM

Semiconductor Device with Air Gaps and Method of Fabrication Thereof

DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS

SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME

PROTECTIVE PASSIVATION LAYER FOR MAGNETIC TUNNEL JUNCTIONS

Method for Manufacturing Ferromagnetic-Dielectric Composite Material

TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHODS FOR DEPOSITING BLOCKING LAYERS ON CONDUCTIVE SURFACES

BORON NITRIDE LAYER, APPARATUS INCLUDING THE SAME, AND METHOD OF FA...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT

Treatment for Adhesion Improvement

DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING...

LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTOR

A METHOD FOR PRODUCING A CRYSTALLINE OXIDE SEMICONDUCTOR FILM AND A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

ALUMINUM NITRIDE SINTERED BODY AND MEMBER FOR SEMICONDUCTOR MANUFAC...

SELECTIVE LAYER FORMATION USING DEPOSITION AND REMOVING

ELECTRICAL COMPONENT WITH A DIELECTRIC PASSIVATION STACK

SILICON-ON-INSULATOR WITH CRYSTALLINE SILICON OXIDE

SUBSTRATE PROCESSING APPARATUS, RAW MATERIAL CARTRIDGE, SUBSTRATE P...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE