the materials containing carbon

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H01L23/4928

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4928the materials containing carbon

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure having a graphene layer
- Patent number 11,205,617
- Issue date Dec 21, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,262,925
- Issue date Apr 16, 2019
- Fuji Electric Co., Ltd.
- Akira Iso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder transfer sheet, solder bump, and solder precoating method us...
- Patent number 10,111,342
- Issue date Oct 23, 2018
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive compositions and methods of using them
- Patent number 10,059,827
- Issue date Aug 28, 2018
- Rajan Hariharan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for capping Cu layer using graphene in semiconductor
- Patent number 9,929,096
- Issue date Mar 27, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive compositions and methods of using them
- Patent number 9,355,938
- Issue date May 31, 2016
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and configuration for manufacturing flip chip contact (FCC)...
- Patent number 9,337,132
- Issue date May 10, 2016
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mono-acid hybrid conductive composition and method
- Patent number 8,564,140
- Issue date Oct 22, 2013
- Alpha Metals, Inc.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power converter device using it, and hybrid v...
- Patent number 7,528,485
- Issue date May 5, 2009
- Hitachi, Ltd.
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having high insulating power and high thermal...
- Patent number 5,786,633
- Issue date Jul 28, 1998
- Siemens Aktiengesellschaft
- Eckhard Wolfgang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealable electronics packages
- Patent number 5,675,122
- Issue date Oct 7, 1997
- Pacific Coast Technologies, Inc.
- Edward A. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component with pressure contact
- Patent number 5,506,452
- Issue date Apr 9, 1996
- Siemens Aktiengesellschaft
- Reinhold Kuhnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealable electronics packages and methods of producing and sealing...
- Patent number 5,433,260
- Issue date Jul 18, 1995
- Pacific Coast Technologies, Inc.
- Edward A. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,500,904
- Issue date Feb 19, 1985
- Hitachi, Ltd.
- Jin Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper matrix electrode having carbon fibers therein
- Patent number 4,470,063
- Issue date Sep 4, 1984
- Hitachi, Ltd.
- Hideo Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal-fiber composite material electrode
- Patent number 4,403,242
- Issue date Sep 6, 1983
- Hitachi, Ltd.
- Masao Tsuruoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electrode plate for supporting semiconductor...
- Patent number 4,254,548
- Issue date Mar 10, 1981
- Hitachi, Ltd.
- Hideo Arakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite joint system including composite structure of carbon fibe...
- Patent number 4,226,917
- Issue date Oct 7, 1980
- Hitachi, Ltd.
- Masao Tsuruoka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ohmic contact of N-GaAs to electrical conductive substrates by cont...
- Patent number 4,213,801
- Issue date Jul 22, 1980
- Bell Telephone Laboratories, Incorporated
- Wilbur D. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,196,442
- Issue date Apr 1, 1980
- Hitachi, Ltd.
- Keiichi Kuniya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180286788
- Publication date Oct 4, 2018
- Fuji Electric Co., Ltd.
- Akira ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING A GRAPHENE LAYER
- Publication number 20180166391
- Publication date Jun 14, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- MING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CAPPING CU LAYER USING GRAPHENE IN SEMICONDUCTOR
- Publication number 20180005952
- Publication date Jan 4, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- MING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...
- Publication number 20170354042
- Publication date Dec 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20140153167
- Publication date Jun 5, 2014
- ALPHA METALS, INC.
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
- Publication number 20100084757
- Publication date Apr 8, 2010
- Rajan Hariharan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbon nanotube-dispersed composite material, method for producing...
- Publication number 20070134496
- Publication date Jun 14, 2007
- SUMITOMO PRECISION PRODUCTS CO., LTD.
- Kazuaki Katagiri
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method for producing carbon nanotube-dispersed composite material
- Publication number 20070057415
- Publication date Mar 15, 2007
- Sumitomo Precision Products Co., Ltd.
- Kazuaki Katagiri
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor device, power converter device using it, and hybrid v...
- Publication number 20060022326
- Publication date Feb 2, 2006
- Toshiaki Morita
- H01 - BASIC ELECTRIC ELEMENTS

the materials containing carbon

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structure having a graphene layer

Semiconductor device and method of manufacturing semiconductor device

Semiconductor arrangement, semiconductor system and method of formi...

Solder transfer sheet, solder bump, and solder precoating method us...

Conductive compositions and methods of using them

Method for capping Cu layer using graphene in semiconductor

Conductive compositions and methods of using them

Methods and configuration for manufacturing flip chip contact (FCC)...

Mono-acid hybrid conductive composition and method

Semiconductor device, power converter device using it, and hybrid v...

Semiconductor module having high insulating power and high thermal...

Sealable electronics packages

Power semiconductor component with pressure contact

Sealable electronics packages and methods of producing and sealing...

Semiconductor device

Copper matrix electrode having carbon fibers therein

Semiconductor device having a metal-fiber composite material electrode

Method of fabricating electrode plate for supporting semiconductor...

Composite joint system including composite structure of carbon fibe...

Ohmic contact of N-GaAs to electrical conductive substrates by cont...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE HAVING A GRAPHENE LAYER

METHOD FOR CAPPING CU LAYER USING GRAPHENE IN SEMICONDUCTOR

Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM

Carbon nanotube-dispersed composite material, method for producing...

Method for producing carbon nanotube-dispersed composite material

Semiconductor device, power converter device using it, and hybrid v...