the opening being a via or contact hole penetrating the underlying conductor

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76805the opening being a via or contact hole penetrating the underlying conductor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and manufacturing method thereof including a c...
- Patent number 12,224,241
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor memory device including an ex...
- Patent number 12,218,062
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 12,218,008
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a Fin at a S/D region and a semiconduct...
- Patent number 12,218,136
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,219,762
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 12,211,747
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming a memory array comprising strings of memory...
- Patent number 12,211,746
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Regina Tien Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,198,978
- Issue date Jan 14, 2025
- Sumitomo Electric Device Innovations, Inc.
- Shouhei Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices, methods for fabricating the same and...
- Patent number 12,199,043
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Geun Won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a metal-oxide-semiconductor field-effect tr...
- Patent number 12,191,196
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective hybrid capping layer for metal gates of transistors
- Patent number 12,183,629
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 12,183,680
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,165,982
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,148,653
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement contact process
- Patent number 12,142,534
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250040170
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...
- Publication number 20240413009
- Publication date Dec 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ling XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240404920
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Yasuhito YOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240387247
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE HYBRID CAPPING LAYER FOR METAL GATES OF TRANSISTORS
- Publication number 20240387257
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379417
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240379432
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...
- Publication number 20240379559
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379431
- Publication date Nov 14, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379734
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20240379412
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ching Tseng
- H01 - BASIC ELECTRIC ELEMENTS

the opening being a via or contact hole penetrating the underlying conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal heterojunction structure with capping metal layer

Semiconductor device and manufacturing method thereof including a c...

Method of fabricating a semiconductor memory device including an ex...

Memory device including self-aligned conductive contacts

Semiconductor device having a Fin at a S/D region and a semiconduct...

Memory arrays comprising strings of memory cells and methods used i...

Integrated circuit device

Semiconductor structure and manufacturing method thereof

Method of forming contact metal

Methods used in forming a memory array comprising strings of memory...

Standard-cell layout structure with horn power and smart metal cut

Three-dimensional memory device having staircase structure and meth...

Method to create MIMcap designs across changing MIMcap structures

Plasma-damage-resistant interconnect structure and methods for form...

Method of manufacturing semiconductor device

Semiconductor memory devices, methods for fabricating the same and...

Method of manufacturing a metal-oxide-semiconductor field-effect tr...

Gate-all-around transistor with reduced source/drain contact resist...

Selective hybrid capping layer for metal gates of transistors

Semiconductor memory device including wiring contact plugs

Bottom lateral expansion of contact plugs through implantation

Semiconductor device

Three-dimensional semiconductor device including a through-via stru...

Semiconductor package structure and method for manufacturing the same

Tiered-profile contact for semiconductor

Semiconductor package and manufacturing method thereof

Semiconductor structure including a trench having a high aspect rat...

Semiconductor device and method having a through substrate via and...

Method of manufacturing semiconductor devices

Replacement contact process

Patents Applicationslast 30 patents

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

Conductive Structures Of Integrated Circuits

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD

DEPOSITION WINDOW ENLARGEMENT

SELECTIVE HYBRID CAPPING LAYER FOR METAL GATES OF TRANSISTORS

HYBRID INTEGRATED CIRCUIT DIES

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

CONTACT FORMATION METHOD AND RELATED STRUCTURE

GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHOD...

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE