the opening being a via or contact hole penetrating the underlying conductor

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76805the opening being a via or contact hole penetrating the underlying conductor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,967,557
- Issue date Apr 23, 2024
- Kioxia Corporation
- Tomoya Inden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 11,963,362
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 11,961,763
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor interconnect
- Patent number 11,961,731
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ru-Shang Hsiao
- B08 - CLEANING
Information Patent Grant
Display device
- Patent number 11,957,017
- Issue date Apr 9, 2024
- SHARP KABUSHIKI KAISHA
- Takayuki Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 11,955,430
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,948,889
- Issue date Apr 2, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 11,942,429
- Issue date Mar 26, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal-based pocket integration process for embedded memory
- Patent number 11,942,133
- Issue date Mar 26, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure, method, layout, and system
- Patent number 11,935,825
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective deposition for integrated circuit interconnect structures
- Patent number 11,935,783
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 11,935,781
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
- Patent number 11,929,281
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,930,641
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure and methods of fabrication thereof
- Patent number 11,923,405
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an oxide material between adjacen...
- Patent number 11,917,825
- Issue date Feb 27, 2024
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 11,915,972
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 11,915,974
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,915,975
- Issue date Feb 27, 2024
- Renesas Electronics Corporation
- Tetsuya Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and manufacturing method of semiconductor device
- Patent number 11,908,701
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having a source/drain contact with a single inner spacer
- Patent number 11,901,434
- Issue date Feb 13, 2024
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,901,228
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for forming the same
- Patent number 11,901,283
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures of three-dimensional memory devices
- Patent number 11,903,204
- Issue date Feb 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- Publication number 20240136221
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240114687
- Publication date Apr 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240114681
- Publication date Apr 4, 2024
- SK HYNIX INC.
- Sung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures And Methods Of Forming The Same
- Publication number 20240113011
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...
- Publication number 20240105584
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET CONTACT FORMATION
- Publication number 20240105590
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
- Publication number 20240105510
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096806
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHAO-HSUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...
- Publication number 20240096694
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Kazuto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20240096998
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...
- Publication number 20240096695
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Michiaki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088045
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jun Hyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20240087960
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20240088016
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20240081066
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ANCHOR PROFILE CONTROL
- Publication number 20240079315
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Shin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071816
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH CONTACT VIA STRUCTURES THAT ARE LATERA...
- Publication number 20240063062
- Publication date Feb 22, 2024
- SANDISK TECHNOLOGIES LLC
- Kouta ONOGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY
- Publication number 20240055522
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE
- Publication number 20240038657
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING T...
- Publication number 20240038586
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240040793
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- SEJIE TAKAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240030138
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED METAL GATE FOR MULTIGATE DEVICE AND METHOD OF FORMING...
- Publication number 20240030066
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Gates of Transistors Having Reduced Resistivity
- Publication number 20240021473
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plug with Impurity Variation
- Publication number 20240021471
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240021474
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Lid.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS

the opening being a via or contact hole penetrating the underlying conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for fabricating microelectronic devices with contacts to co...

Semiconductor device and manufacturing method thereof

Semiconductor devices and data storage systems including the same

Self-aligned metal gate for multigate device and method of forming...

Method and structure for semiconductor interconnect

Display device

Interconnect structure and forming method thereof

Method of manufacturing semiconductor device and semiconductor devices

Semiconductor memory device

Three-dimensional memory device and method of making thereof using...

Pedestal-based pocket integration process for embedded memory

Contact structure, method, layout, and system

Selective deposition for integrated circuit interconnect structures

Integrated circuit structure with backside dielectric layer having...

Reducing oxidation by etching sacrificial and protection layer sepa...

Liner-free conductive structures with anchor points

Semiconductor devices

Stacked integrated circuits with redistribution lines

Metal-insulator-metal structure and methods of fabrication thereof

Microelectronic devices including an oxide material between adjacen...

Methods of forming spacers for semiconductor devices including back...

Backside power rail integration

Integrated circuitry, a memory array comprising strings of memory c...

Method of manufacturing semiconductor device

Interconnect structure for stacked device

Patterning method and manufacturing method of semiconductor device

Semiconductor having a source/drain contact with a single inner spacer

Self-aligned scheme for semiconductor device and method of forming...

Capacitor and method for forming the same

Interconnect structures of three-dimensional memory devices

Patents Applicationslast 30 patents

INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP

INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Structures And Methods Of Forming The Same

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...

STACKED FET CONTACT FORMATION

PLASMA-DOPED TRENCHES FOR MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

HYBRID CONDUCTIVE STRUCTURES

SEMICONDUCTOR DEVICE HAVING EDGE SEAL AND METHOD OF MAKING THEREOF...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

Metal-Insulator-Metal Structure

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

VIA ANCHOR PROFILE CONTROL

STAIRCASE FORMATION IN A MEMORY ARRAY

FIELD EFFECT TRANSISTOR WITH CONTACT VIA STRUCTURES THAT ARE LATERA...

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY

VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE

SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING T...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SELF-ALIGNED METAL GATE FOR MULTIGATE DEVICE AND METHOD OF FORMING...

Metal Gates of Transistors Having Reduced Resistivity

Contact Plug with Impurity Variation

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE