the other connecting portion not on the bonding area also being a wedge bond

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48472the other connecting portion not on the bonding area also being a wedge bond

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,021,012
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance measurement
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- Issue date Jun 25, 2024
- Analog Devices International Unlimited Company
- Jose Carlos Conchell Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 11,749,634
- Issue date Sep 5, 2023
- Kioxia Corporation
- Kazuya Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete power transistor package having solderless DBC to leadfram...
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- Issue date Jul 12, 2022
- Littelfuse, Inc.
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,387,173
- Issue date Jul 12, 2022
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,346,879
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Chihiro Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly including a circuit carrier
- Patent number 11,276,623
- Issue date Mar 15, 2022
- Vitesco Technologies GmbH
- Erich Mattmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 11,164,846
- Issue date Nov 2, 2021
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for detecting a pressure of a fluid medium and method for ma...
- Patent number 11,143,562
- Issue date Oct 12, 2021
- Robert Bosch GmbH
- Markus Reinhard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,133,398
- Issue date Sep 28, 2021
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- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
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- Issue date Sep 21, 2021
- ABB Power Grids Switzerland AG
- Samuel Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
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- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion apparatus and electric vehicle
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- Issue date Aug 10, 2021
- Hitachi, Ltd.
- Kinya Nakatsu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and semiconductor device fabrication method
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- Issue date Jul 27, 2021
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bio-impedance and contact impedances measurement
- Patent number 11,047,821
- Issue date Jun 29, 2021
- Analog Devices International Unlimited Company
- Jose Carlos Conchell Ano
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 11,031,355
- Issue date Jun 8, 2021
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module with coaxial arrangement of the DC terminals
- Patent number 11,018,117
- Issue date May 25, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
- Publication number 20240332141
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
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- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240243198
- Publication date Jul 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Hiroshi YANAGIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087996
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047300
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230299038
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230105834
- Publication date Apr 6, 2023
- Rohm Co., Ltd.
- Daichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301991
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Katsutoki SHIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage-Controlled Switching Device with Resistive Path
- Publication number 20220102478
- Publication date Mar 31, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077022
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Tatsuo TONEDACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR
- Publication number 20210391445
- Publication date Dec 16, 2021
- Rohm Co., Ltd.
- Akihiro HIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MEASUREMENT
- Publication number 20210325328
- Publication date Oct 21, 2021
- Analog Devices International Unlimited Company
- Jose Carlos Conchell ANO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20210210457
- Publication date Jul 8, 2021
- KIOXIA Corporation
- Kazuya MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20210143103
- Publication date May 13, 2021
- Mitsubishi Electric Corporation
- Roberto MRAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098346
- Publication date Apr 1, 2021
- Rohm Co., Ltd.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INVERTER MODULE WITH REDUCED INDUCTANCE
- Publication number 20210020588
- Publication date Jan 21, 2021
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Marko Jaksic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement Having a Base Plate and a Co...
- Publication number 20200321223
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Marianna Nomann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...
- Publication number 20200303281
- Publication date Sep 24, 2020
- IXYS, LLC
- Gi-Young Jeun
- H01 - BASIC ELECTRIC ELEMENTS

the other connecting portion not on the bonding area also being a wedge bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor device and method for fabricating the same

Semiconductor device

Impedance measurement

Offset interposers for large-bottom packages and large-die package-...

Semiconductor device including sense insulated-gate bipolar transistor

Semiconductor device and method for fabricating the same

Solder material

Wire bond wires for interference shielding

Offset interposers for large-bottom packages and large-die package-...

Method for bonding insulated coating wire, connection structure, me...

Semiconductor device and wire bonding method

Wire bond wires for interference shielding

Impedance controlled electrical interconnection employing meta-mate...

Discrete power transistor package having solderless DBC to leadfram...

Method for manufacturing semiconductor device

Semiconductor device

Power electronics assembly including a circuit carrier

Semiconductor device manufacturing method and soldering support jig

Solder material for semiconductor device

Device for detecting a pressure of a fluid medium and method for ma...

Semiconductor device including sense insulated-gate bipolar transistor

Power semiconductor module

Wire bonding tool including a wedge tool

Power conversion apparatus and electric vehicle

Semiconductor device and semiconductor device fabrication method

Bio-impedance and contact impedances measurement

Semiconductor device

Half-bridge module with coaxial arrangement of the DC terminals

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

Voltage-Controlled Switching Device with Resistive Path

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

IMPEDANCE MEASUREMENT

SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE

SEMICONDUCTOR DEVICE

POWER INVERTER MODULE WITH REDUCED INDUCTANCE

Power Semiconductor Module Arrangement Having a Base Plate and a Co...

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAM...