the other leads having an insulating passage through the base

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/045the other leads having an insulating passage through the base

Industries

Patents Grantslast 30 patents

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the other leads having an insulating passage through the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component and method for producing a component

Discrete power transistor package having solderless DBC to leadfram...

Stem for semiconductor package

Base body with soldered-on ground pin, method for its production an...

Semiconductor device, power converter, and method of manufacturing...

Hermetically sealed electronic packages with electrically powered m...

Method of manufacturing a semiconductor device

SMD package with top side cooling

Electronic component mounting package and electronic device using t...

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor structure and fabrication method thereof

Fan out wafer level package type semiconductor package and package...

Housing assembly and memory device

High-frequency module

Power semiconductor module, method for manufacturing the same, and...

High-frequency module

Electronic component mounting package and electronic apparatus usin...

Housing for a semiconductor chip and semiconductor chip with a housing

Electrical feedthrough assembly

High-frequency semiconductor package and high-frequency semiconduct...

Transistor outline housing and method for producing same

Electronic component mounting device and method for producing the same

Nitride semiconductor light-emitting system

Semiconductor module

Semiconductor module

Microwave circuit package

Flange package for a semiconductor device

Semiconductor equipment and method of manufacturing the same

Flange package for a semiconductor device

Electronic component package and method of manufacturing the same,...

Patents Applicationslast 30 patents

DEVICE

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE

HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SMD Package with Top Side Cooling

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

FAN OUT WAFER LEVEL PACKAGE TYPE SEMICONDUCTOR PACKAGE AND PACKAGE...

POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND...

HIGH-FREQUENCY MODULE

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCT...

NITRIDE SEMICONDUCTOR LIGHT-EMITTING SYSTEM

TRANSISTOR OUTLINE HOUSING AND METHOD FOR PRODUCING SAME

Housing for a Semiconductor Chip and Semiconductor Chip with a Housing

ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC APPARATUS USIN...

METHOD FOR FORMING SEALED ELECTRICAL FEEDTHROUGHS THROUGH AN ENCAPS...

Electrical Feedthrough Assembly

SEMICONDUCTOR MODULE

FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR EQUIPMENT AND METHOD OF MANUFACTURING THE SAME

MICROWAVE CIRCUIT PACKAGE

BASE DESIGN FOR SELF-CENTERING

Flange Package For A Semiconductor Device

ELECTRONIC COMPONENT PACKAGE

Sealing Board and Method for Producing the Same

Integrated Circuit Package with Passive Component

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME,...

NON-UNIFORM FEEDTHROUGH AND LEAD CONFIGURATION FOR A TRANSISTOR OUT...