the precursor containing a compound comprising Si

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H01L21/02208

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02208the precursor containing a compound comprising Si

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Patents Grantslast 30 patents

Information Patent Grant
Formation of SiOC thin films
- Patent number 12,272,546
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Toshiya Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming low-stress silicon nitride layer through hydrogen treatment
- Patent number 12,261,036
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of post treating silicon nitride based dielectric films wit...
- Patent number 12,230,499
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Yong Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon nitride films
- Patent number 12,230,495
- Issue date Feb 18, 2025
- Lam Research Corporation
- James S. Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for etching features using a targeted deposition for selecti...
- Patent number 12,217,955
- Issue date Feb 4, 2025
- Lam Research Corporation
- Wenchi Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing chamber to accommodate parasitic plasma fo...
- Patent number 12,205,845
- Issue date Jan 21, 2025
- Applied Materials, Inc.
- Khokan Chandra Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modulating stress of dielectric layers
- Patent number 12,125,911
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sealing a seam, semiconductor structure, and method for...
- Patent number 12,094,768
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for reducing effluent build-up in a pumping exh...
- Patent number 12,049,698
- Issue date Jul 30, 2024
- Lam Research Corporation
- Antonio Xavier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for manufacturing a thin film and a method therefor
- Patent number 12,014,922
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsai-Fu Hsiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicide films through selective deposition
- Patent number 11,978,635
- Issue date May 7, 2024
- Applied Materials, Inc.
- Swaminathan Srinivasan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate structures in transistor devices and methods of forming same
- Patent number 11,967,504
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming silicon nitride films using microwave plasma
- Patent number 11,955,331
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,955,333
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Jethro Tannos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor isolation structures
- Patent number 11,908,921
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selective deposition of silicon nitride layer and struct...
- Patent number 11,901,175
- Issue date Feb 13, 2024
- ASM IP Holding B.V.
- Eric James Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 11,881,508
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Kyungin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with gate spacer
- Patent number 11,854,796
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Yao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer forming method and apparatus
- Patent number 11,830,730
- Issue date Nov 28, 2023
- ASM IP Holding B.V.
- Arjen Klaver
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming low-stress silicon nitride layer through hydrogen treatment
- Patent number 11,830,727
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film forming method
- Patent number 11,823,866
- Issue date Nov 21, 2023
- ASM IP Holding B.V.
- SungKyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 11,817,314
- Issue date Nov 14, 2023
- Kokusai Electric Corporation
- Katsuyoshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of SiN thin films
- Patent number 11,784,043
- Issue date Oct 10, 2023
- ASM IP Holding, B.V.
- Toshiya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced deposition processes for controlled formation of ox...
- Patent number 11,776,807
- Issue date Oct 3, 2023
- ASM IP Holding, B.V.
- Lingyun Jia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming high carbon content flowable dielectric film with low proce...
- Patent number 11,756,786
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for depositing silicon-containing thin film containing...
- Patent number 11,749,522
- Issue date Sep 5, 2023
- DNF Co., Ltd.
- Sung Gi Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition and methods using same for carbon doped silicon contain...
- Patent number 11,742,200
- Issue date Aug 29, 2023
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing III-alloys on substrates and compositions th...
- Patent number 11,721,550
- Issue date Aug 8, 2023
- United States Department of Energy
- Emily Lowell Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20250118550
- Publication date Apr 10, 2025
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU SIDEWALL PASSIVATION TOWARD THE BOTTOM OF HIGH ASPECT RATIO...
- Publication number 20250095984
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Sonam Dorje Sherpa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A METAL SILICATE LAYER FOR CONTROLLING A THRESH...
- Publication number 20250087478
- Publication date Mar 13, 2025
- ASM IP HOLDING B.V.
- Patricio Eduardo Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAPFILL METHOD, SYSTEM AND APPARATUS
- Publication number 20250079160
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Jereld Lee Winkler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250054753
- Publication date Feb 13, 2025
- ASM IP HOLDING B.V.
- KiHun Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD
- Publication number 20250051911
- Publication date Feb 13, 2025
- AIR WATER INC.
- Fumio KAWASAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS
- Publication number 20240387729
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT
- Publication number 20240379346
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PRECURSOR COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAIN...
- Publication number 20240376599
- Publication date Nov 14, 2024
- UP CHEMICAL CO., LTD.
- Byung Kwan KIM
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Protection Layer Formation during Plasma Etching Conductive Materials
- Publication number 20240371655
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...
- Publication number 20240332001
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20240304438
- Publication date Sep 12, 2024
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240274433
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Tsuyoshi TSUNATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240249947
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures in Transistor Devices and Methods of Forming Same
- Publication number 20240249938
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FORMING STRUCTURES COMPRISING A THRESHOLD V...
- Publication number 20240234129
- Publication date Jul 11, 2024
- ASM IP HOLDING B.V.
- Charles Dezelah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240194456
- Publication date Jun 13, 2024
- Tokyo Electron Limited
- Hiroki MURAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING THIN FILM USING MATERIAL OF CHEMICAL PURGE
- Publication number 20240194481
- Publication date Jun 13, 2024
- EGTM Co., Ltd.
- Kyu Ho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
- Publication number 20240145230
- Publication date May 2, 2024
- Applied Materials, Inc.
- Abhishek Mandal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240087880
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Shruba Gangopadhyay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240087881
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Michael Haverty
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240038530
- Publication date Feb 1, 2024
- Kokusai Electric Corporation
- Katsuyoshi HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING ATOMIC LAYER AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20230420248
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyunjun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment
- Publication number 20230386826
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20230377874
- Publication date Nov 23, 2023
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACK-CONTACT SOLAR CELL, AND PRODUCTION THEREOF
- Publication number 20230335663
- Publication date Oct 19, 2023
- EnPV GmbH
- Erik HOFFMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k Feature Formation Processes and Structures Formed Thereby
- Publication number 20230326746
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A LAYER ON ONLY CERTAIN SURFACES OF A STRUCTURE
- Publication number 20230326745
- Publication date Oct 12, 2023
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES AL TERNATIVES
- Marceline BONVALOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL IMPROVEMENTS FOR 3D NAND
- Publication number 20230309300
- Publication date Sep 28, 2023
- Applied Materials, Inc.
- Dimitrios Pavlopoulos
- H01 - BASIC ELECTRIC ELEMENTS

the precursor containing a compound comprising Si

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Formation of SiOC thin films

Forming low-stress silicon nitride layer through hydrogen treatment

Methods of post treating silicon nitride based dielectric films wit...

Method of depositing silicon nitride films

Method for etching features using a targeted deposition for selecti...

Semiconductor processing chamber to accommodate parasitic plasma fo...

Method of modulating stress of dielectric layers

Method for sealing a seam, semiconductor structure, and method for...

Systems and methods for reducing effluent build-up in a pumping exh...

Apparatus for manufacturing a thin film and a method therefor

Silicide films through selective deposition

Gate structures in transistor devices and methods of forming same

Method of manufacturing semiconductor device, substrate processing...

Method of forming silicon nitride films using microwave plasma

Methods and apparatus for processing a substrate

Device of dielectric layer

Transistor isolation structures

Method for selective deposition of silicon nitride layer and struct...

Method of fabricating a semiconductor device

Semiconductor device structure with gate spacer

Layer forming method and apparatus

Forming low-stress silicon nitride layer through hydrogen treatment

Thin film forming method

Method of processing substrate, method of manufacturing semiconduct...

Formation of SiN thin films

Plasma enhanced deposition processes for controlled formation of ox...

Forming high carbon content flowable dielectric film with low proce...

Composition for depositing silicon-containing thin film containing...

Composition and methods using same for carbon doped silicon contain...

Methods for depositing III-alloys on substrates and compositions th...

Patents Applicationslast 30 patents

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

IN-SITU SIDEWALL PASSIVATION TOWARD THE BOTTOM OF HIGH ASPECT RATIO...

METHODS FOR FORMING A METAL SILICATE LAYER FOR CONTROLLING A THRESH...

GAPFILL METHOD, SYSTEM AND APPARATUS

SUBSTRATE PROCESSING METHOD

FILM FORMING METHOD

METHOD OF MODULATING STRESS OF DIELECTRIC LAYERS

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT

SILICON PRECURSOR COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAIN...

Protection Layer Formation during Plasma Etching Conductive Materials

ATOMIC LAYER DEPOSITION OF SILICON-CARBON-AND-NITROGEN-CONTAINING M...

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

DEVICE OF DIELECTRIC LAYER

Gate Structures in Transistor Devices and Methods of Forming Same

METHODS AND SYSTEMS FOR FORMING STRUCTURES COMPRISING A THRESHOLD V...

FILM FORMING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF FORMING THIN FILM USING MATERIAL OF CHEMICAL PURGE

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD OF DEPOSITING ATOMIC LAYER AND METHOD OF MANUFACTURING SEMIC...

Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

BACK-CONTACT SOLAR CELL, AND PRODUCTION THEREOF

Low-k Feature Formation Processes and Structures Formed Thereby

METHOD FOR PRODUCING A LAYER ON ONLY CERTAIN SURFACES OF A STRUCTURE

ELECTRICAL IMPROVEMENTS FOR 3D NAND