the preform being at least partly pre-patterned

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H01L2224/11438

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11438the preform being at least partly pre-patterned

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Patents Grantslast 30 patents

Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR