The principal constituent being an elastomer

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H01L2224/29691

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29691The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...
- Publication number 20170158926
- Publication date Jun 8, 2017
- Shin-Etsu Chemical Co., Ltd.
- Koichi TSUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...
- Publication number 20170062374
- Publication date Mar 2, 2017
- Industry-Academic Cooperation Foundation, Yonsei University
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS