The principal constituent being an elastomer

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13291The principal constituent being an elastomer

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Patents Grantslast 30 patents

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Method for fabricating an electronic device comprising forming an i...
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- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic device including a protective wafer bonded to a...
- Patent number 9,773,740
- Issue date Sep 26, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,378,486
- Issue date Feb 19, 2013
- Renesas Electronics Corporation
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving thermal energy dissipation in a...
- Patent number 7,817,434
- Issue date Oct 19, 2010
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20110095420
- Publication date Apr 28, 2011
- RENESAS ELECTRONICS CORPORATION
- Fumihiro Bekku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving thermal energy dissipation in a...
- Publication number 20060211461
- Publication date Sep 21, 2006
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating an electronic device comprising forming an i...

Method for fabricating an electronic device and a stacked electroni...

Semiconductor device and corresponding method

Method for manufacturing semiconductor apparatus, method for manufa...

Method for fabricating an electronic device and a stacked electroni...

Stacked electronic device including a protective wafer bonded to a...

Semiconductor device and method of manufacturing semiconductor device

Method and apparatus for improving thermal energy dissipation in a...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

FORMATION OF CONDUCTIVE CIRCUIT

Semiconductor device and method of manufacturing semiconductor device

Method and apparatus for improving thermal energy dissipation in a...