The principal constituent being an elastomer

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H01L2924/15791

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15791The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 10,334,724
- Issue date Jun 25, 2019
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bendable and stretchable electronic devices and methods
- Patent number 10,204,855
- Issue date Feb 12, 2019
- Intel Corporation
- Alejandro Levander
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and manufacturing method thereof
- Patent number 10,186,503
- Issue date Jan 22, 2019
- Mitsumi Electric Co., Ltd.
- Makoto Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 9,706,647
- Issue date Jul 11, 2017
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interconnect structures and methods of making the same
- Patent number 9,173,282
- Issue date Oct 27, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages
- Patent number 8,916,875
- Issue date Dec 23, 2014
- Samsung Electronics Co., Ltd.
- Jongjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS
- Publication number 20180092205
- Publication date Mar 29, 2018
- MC10, Inc.
- YUNG-YU HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20170148723
- Publication date May 25, 2017
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATI...
- Publication number 20160293816
- Publication date Oct 6, 2016
- Oki Data Corporation
- Taishi KANETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS
- Publication number 20160284630
- Publication date Sep 29, 2016
- Intel Corporation
- Alejandro Levander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120248439
- Publication date Oct 4, 2012
- Samsung Electronics Co., Ltd.
- Jongjoo LEE
- H01 - BASIC ELECTRIC ELEMENTS

The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conformal electronics including nested serpentine interconnects

Semiconductor device having polyimide layer

Bendable and stretchable electronic devices and methods

Module and manufacturing method thereof

Conformal electronics including nested serpentine interconnects

Interconnect structures and methods of making the same

Semiconductor packages

Patents Applicationslast 30 patents

CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATI...

BENDABLE AND STRETCHABLE ELECTRONIC DEVICES AND METHODS

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGES