The principal constituent being an elastomer

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H01L2224/29291

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29291The principal constituent being an elastomer

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Patents Grantslast 30 patents

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The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Electronic package, heat dissipation structure and manufacturing me...

Electronic device and manufacturing method of electronic device

Adhesive bonding composition and method of use

Apparatus and method for securing components of an integrated circuit

Light-emitting device

Method for fabricating an electronic device comprising forming an i...

Semiconductor packaging structure and process

Apparatus and method for securing components of an integrated circuit

Adhesive bonding composition and method of use

Bond materials with enhanced plasma resistant characteristics and a...

Method for fabricating an electronic device and a stacked electroni...

Thermally conductive sheet, production method for thermally conduct...

Releasable thermal gel

Adhesive bonding composition and method of use

Anisotropic conductive film and connection structure

3D-joining of microelectronic components with conductively self-adj...

Resin composition, bonded body and semiconductor device

Epoxy resin composition, semiconductor sealing agent, and semicondu...

Computing system with a thermal interface comprising magnetic parti...

Method for fabricating an electronic device and a stacked electroni...

Semiconductor packaging structure and process

Method for simultaneously bonding multiple chips of different heigh...

Semiconductor chip, method for producing a plurality of semiconduct...

Underfill material, laminated sheet and method for producing semico...

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Thermal conductive silicone composition and semiconductor device

Stacked electronic device including a protective wafer bonded to a...

Semiconductor packaging structure and process

Patents Applicationslast 30 patents

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

PASTE COMPOSITION AND SEMICONDUCTOR DEVICE

Joining and Insulating Power Electronic Semiconductor Components

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

Compliant Electronic Component Interconnection

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

LIGHT-EMITTING DEVICE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

RELEASABLE THERMAL GEL

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING ANISOTROPI...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Thermally Conductive Sheet, Production Method for Thermally Conduct...

RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

Electric Device Package Comprising a Laminate and Method of Making...

ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

Power Semiconductor Chip Having Two Metal Layers on One Face

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF