The principal constituent being an elastomer

Industry

CPC
H01L2224/29291

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29291The principal constituent being an elastomer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and manufacturing method of electronic device
- Patent number 11,948,908
- Issue date Apr 2, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 11,631,600
- Issue date Apr 18, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,594,662
- Issue date Feb 28, 2023
- Nichia Corporation
- Toshifumi Imura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 10,784,128
- Issue date Sep 22, 2020
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable thermal gel
- Patent number 10,428,256
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ling Shen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connection structure
- Patent number 10,388,624
- Issue date Aug 20, 2019
- Dexerials Corporation
- Shinichi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, bonded body and semiconductor device
- Patent number 10,249,591
- Issue date Apr 2, 2019
- Mitsubishi Materials Corporation
- Hiroto Akaike
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 10,196,513
- Issue date Feb 5, 2019
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Computing system with a thermal interface comprising magnetic parti...
- Patent number 10,181,432
- Issue date Jan 15, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,177,098
- Issue date Jan 8, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for producing a plurality of semiconduct...
- Patent number 10,134,943
- Issue date Nov 20, 2018
- Osram Opto Semiconductors GmbH
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,840,645
- Issue date Dec 12, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive silicone composition and semiconductor device
- Patent number 9,783,723
- Issue date Oct 10, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shota Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic device including a protective wafer bonded to a...
- Patent number 9,773,740
- Issue date Sep 26, 2017
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill composition for encapsulating a bond line
- Patent number 9,670,377
- Issue date Jun 6, 2017
- Namics Corporation
- Pawel Czubarow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader with wiring substrate for reduced thickness
- Patent number 9,666,506
- Issue date May 30, 2017
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230238348
- Publication date Jul 27, 2023
- KYOCERA CORPORATION
- Yuya NITANAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Electronic Component Interconnection
- Publication number 20220052012
- Publication date Feb 17, 2022
- Paricon Technologies Corporation
- Larre H. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20220005780
- Publication date Jan 6, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20210036193
- Publication date Feb 4, 2021
- Nichia Corporation.
- Toshifumi IMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
RELEASABLE THERMAL GEL
- Publication number 20190119544
- Publication date Apr 25, 2019
- HONEYWELL INTERNATIONAL INC.
- Ling Shen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING ANISOTROPI...
- Publication number 20190100663
- Publication date Apr 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermally Conductive Sheet, Production Method for Thermally Conduct...
- Publication number 20190055443
- Publication date Feb 21, 2019
- Dexerials Corporation
- Hiroki Kanaya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE
- Publication number 20180286829
- Publication date Oct 4, 2018
- MITSUBISHI MATERIALS CORPORATION
- Hiroto Akaike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20180277505
- Publication date Sep 27, 2018
- DEXERIALS CORPORATION
- Shinichi HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...
- Publication number 20180269128
- Publication date Sep 20, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20170096591
- Publication date Apr 6, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shota AKIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package Comprising a Laminate and Method of Making...
- Publication number 20140027892
- Publication date Jan 30, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20130154125
- Publication date Jun 20, 2013
- Hye Jin KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS
- Publication number 20130147028
- Publication date Jun 13, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086126
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and manufacturing method of electronic device

Adhesive bonding composition and method of use

Apparatus and method for securing components of an integrated circuit

Light-emitting device

Method for fabricating an electronic device comprising forming an i...

Semiconductor packaging structure and process

Apparatus and method for securing components of an integrated circuit

Adhesive bonding composition and method of use

Bond materials with enhanced plasma resistant characteristics and a...

Method for fabricating an electronic device and a stacked electroni...

Thermally conductive sheet, production method for thermally conduct...

Releasable thermal gel

Adhesive bonding composition and method of use

Anisotropic conductive film and connection structure

3D-joining of microelectronic components with conductively self-adj...

Resin composition, bonded body and semiconductor device

Epoxy resin composition, semiconductor sealing agent, and semicondu...

Computing system with a thermal interface comprising magnetic parti...

Method for fabricating an electronic device and a stacked electroni...

Semiconductor packaging structure and process

Method for simultaneously bonding multiple chips of different heigh...

Semiconductor chip, method for producing a plurality of semiconduct...

Underfill material, laminated sheet and method for producing semico...

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Thermal conductive silicone composition and semiconductor device

Stacked electronic device including a protective wafer bonded to a...

Semiconductor packaging structure and process

Underfill composition for encapsulating a bond line

Heat spreader with wiring substrate for reduced thickness

Patents Applicationslast 30 patents

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

PASTE COMPOSITION AND SEMICONDUCTOR DEVICE

Joining and Insulating Power Electronic Semiconductor Components

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

Compliant Electronic Component Interconnection

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

LIGHT-EMITTING DEVICE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

RELEASABLE THERMAL GEL

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING ANISOTROPI...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Thermally Conductive Sheet, Production Method for Thermally Conduct...

RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTI...

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

Electric Device Package Comprising a Laminate and Method of Making...

ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS

Power Semiconductor Chip Having Two Metal Layers on One Face

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD