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The principal constituent being an elastomer
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CPC
H01L2224/05391
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05391
The principal constituent being an elastomer
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Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FO...
Publication number
20210249371
Publication date
Aug 12, 2021
Advanced Semiconductor Engineering, Inc.
Jia-Zhe LEE
B81 - MICRO-STRUCTURAL TECHNOLOGY