the principal constituent melting at a temperature of greater than 1550 C

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H01L2924/17763

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/17763the principal constituent melting at a temperature of greater than 1550 C

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating resin composition, semiconductor device using the enc...
- Patent number 9,932,473
- Issue date Apr 3, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Emi Iwatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with thick die pad functioning as a...
- Patent number 9,418,920
- Issue date Aug 16, 2016
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...
- Publication number 20160343643
- Publication date Nov 24, 2016
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...
- Publication number 20160289443
- Publication date Oct 6, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- EMI IWATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD, AND ASSOCIATED...
- Publication number 20160197030
- Publication date Jul 7, 2016
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...
- Publication number 20130334712
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS