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the principal constituent melting at a temperature of greater than 1550 C

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  • CPC
  • H01L2924/16763
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/16763the principal constituent melting at a temperature of greater than 1550 C
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