the principal constituent melting at a temperature of greater than 1550 C

Industry

CPC
H01L2924/15763

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15763the principal constituent melting at a temperature of greater than 1550 C

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package allowing...
- Patent number 11,437,556
- Issue date Sep 6, 2022
- Hag Mo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-laminated chip-on-film-type semiconductor package having i...
- Patent number 11,355,687
- Issue date Jun 7, 2022
- Hag Mo Kim
- G02 - OPTICS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating packaging substrate
- Patent number 11,031,329
- Issue date Jun 8, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,903,151
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive interconnect in a semiconductor package
- Patent number 10,609,813
- Issue date Mar 31, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate, semiconductor package structure and method...
- Patent number 10,418,316
- Issue date Sep 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost substrates
- Patent number 10,283,484
- Issue date May 7, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated circuit package comprising surface capacitor and ground...
- Patent number 10,181,410
- Issue date Jan 15, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a trench penetrating a main body
- Patent number 10,056,325
- Issue date Aug 21, 2018
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers, semiconductor devices, method for manufacturing interp...
- Patent number 10,056,322
- Issue date Aug 21, 2018
- Toppan Printing Co., Ltd.
- Koji Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method of fabricating the same
- Patent number 10,002,823
- Issue date Jun 19, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 9,872,392
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages
- Patent number 9,837,328
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,837,327
- Issue date Dec 5, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and methods of making and using the same
- Patent number 9,666,516
- Issue date May 30, 2017
- General Electric Company
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaged integrated circuit
- Patent number 9,287,236
- Issue date Mar 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
- Patent number 8,853,835
- Issue date Oct 7, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 8,674,520
- Issue date Mar 18, 2014
- Fujitsu Limited
- Nobuhiro Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor element
- Patent number 8,598,014
- Issue date Dec 3, 2013
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor component
- Patent number 8,575,003
- Issue date Nov 5, 2013
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20220299278
- Publication date Sep 22, 2022
- JFE PRECISION CORPORATION
- Hoshiaki TERAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...
- Publication number 20210210416
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035931
- Publication date Feb 4, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190363040
- Publication date Nov 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...
- Publication number 20190311979
- Publication date Oct 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...
- Publication number 20190057880
- Publication date Feb 21, 2019
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20180374827
- Publication date Dec 27, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240747
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240748
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DECOUPLING ATTACHMENT
- Publication number 20170359898
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE
- Publication number 20170359893
- Publication date Dec 14, 2017
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20170338174
- Publication date Nov 23, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20170148723
- Publication date May 25, 2017
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...
- Publication number 20170133352
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170133311
- Publication date May 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20170133353
- Publication date May 11, 2017
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING LOW COST SUBSTRATES
- Publication number 20160329301
- Publication date Nov 10, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20160293508
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME
- Publication number 20160155693
- Publication date Jun 2, 2016
- GENERAL ELECTRIC COMPANY
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGED INTEGRATED CIRCUIT
- Publication number 20160020189
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MU...
- Publication number 20130043579
- Publication date Feb 21, 2013
- ABB TECHNOLOGY AG
- Franc DUGAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20120211899
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Nobuhiro IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Semiconductor Element
- Publication number 20120040484
- Publication date Feb 16, 2012
- Osram Opto Semiconductors GmbH
- Michael FEHRER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a semiconductor component
- Publication number 20090311847
- Publication date Dec 17, 2009
- Michael Fehrer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC CO...
- Publication number 20090148720
- Publication date Jun 11, 2009
- Murata Manufacturing Co., Ltd.
- Hiroki KITAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME STRUCTURE
- Publication number 20090051022
- Publication date Feb 26, 2009
- DENSO CORPORATION
- Kouji ANDOH
- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of greater than 1550 C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat sink, semiconductor package and semiconductor module

Hermetic package for high CTE mismatch

Package for a semiconductor device

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor device

Jointing material, fabrication method for semiconductor device usin...

Graphite-laminated chip-on-film-type semiconductor package allowing...

Graphite-laminated chip-on-film-type semiconductor package having i...

Power decoupling attachment

Method of fabricating packaging substrate

Semiconductor device package and method of manufacturing the same

Capacitive interconnect in a semiconductor package

Bonding wire for semiconductor device

Semiconductor substrate, semiconductor package structure and method...

Low cost substrates

Semiconductor device having polyimide layer

Integrated circuit package comprising surface capacitor and ground...

Semiconductor package having a trench penetrating a main body

Interposers, semiconductor devices, method for manufacturing interp...

Packaging substrate and method of fabricating the same

Power module with the integration of control circuit

Power decoupling attachment

Semiconductor device packages

Methods for forming semiconductor device packages

Electronic packages and methods of making and using the same

Flexible packaged integrated circuit

Chip arrangements, a chip package and a method for manufacturing a...

Semiconductor device, method for manufacturing the same, and power...

Method for producing a semiconductor element

Method for producing a semiconductor component

Patents Applicationslast 30 patents

PACKAGE FOR A SEMICONDUCTOR DEVICE

HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD...

INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND...

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

POWER DECOUPLING ATTACHMENT

CAPACITIVE INTERCONNECT IN A SEMICONDUCTOR PACKAGE

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL IN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

METHOD FOR PREPARING LOW COST SUBSTRATES

SEMICONDUCTOR DEVICE PACKAGES

ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME

FLEXIBLE PACKAGED INTEGRATED CIRCUIT

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MU...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

Method for Producing a Semiconductor Element

Method for producing a semiconductor component

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC CO...

LEAD FRAME STRUCTURE