the principal constituent melting at a temperature of greater than 1550°C

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H01L2224/13263

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13263the principal constituent melting at a temperature of greater than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents