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the principal constituent melting at a temperature of greater than 1550°C

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  • CPC
  • H01L2224/45363
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45363the principal constituent melting at a temperature of greater than 1550°C
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire and bonded connection
    • Patent number 7,319,196
    • Issue date Jan 15, 2008
    • EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
    • Guy LeFranc
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents