the principal constituent melting at a temperature of greater than 1550°C

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H01L2224/13663

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13663the principal constituent melting at a temperature of greater than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Test probe head for full wafer testing
- Patent number 10,330,701
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming surface protrusions on an article and the article...
- Patent number 10,132,836
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...
- Publication number 20180348259
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR