the principal constituent melting at a temperature of greater than 1550°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13163the principal constituent melting at a temperature of greater than 1550°C

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Patents Grantslast 30 patents

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the principal constituent melting at a temperature of greater than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device, and set of onboard-components, body a...

Lead free solder columns and methods for making same

Semiconductor device including conductive layer and conductive pill...

Method for producing metal ball, joining material, and metal ball

Systems and methods for testing and packaging a superconducting chip

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR TESTING AND PACKAGING A SUPERCONDUCTING CHIP

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

Nanoscale probes for electrophysiological applications