the principal constituent melting at a temperature of greater than 1550°C

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H01L2224/05663

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05663the principal constituent melting at a temperature of greater than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive testing of integrated circuit chips
- Patent number 10,651,099
- Issue date May 12, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser mounting with intact diffusion barrier layer
- Patent number 10,224,693
- Issue date Mar 5, 2019
- SpectraSensors, Inc.
- Alfred Feitisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser mounting with intact diffusion barrier layer
- Patent number 9,711,937
- Issue date Jul 18, 2017
- SpectraSensors, Inc.
- Alfred Feitisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser mounting with intact diffusion barrier layer
- Patent number 9,166,364
- Issue date Oct 20, 2015
- SpectraSensors, Inc.
- Alfred Feitisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153900
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153902
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
- Publication number 20240105667
- Publication date Mar 28, 2024
- TANAKA DENSHI KOGYO K.K.
- Shuichi MITOMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170365567
- Publication date Dec 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yun Bog KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER
- Publication number 20170317468
- Publication date Nov 2, 2017
- SPECTRASENSORS, INC.
- Alfred Feitisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER
- Publication number 20130044322
- Publication date Feb 21, 2013
- Alfred Feitisch
- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of greater than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Protective surface layer on under bump metallurgy for solder joining

Non-destructive testing of integrated circuit chips

Semiconductor laser mounting with intact diffusion barrier layer

Semiconductor laser mounting with intact diffusion barrier layer

Semiconductor packaging containing sintering die-attach material

Semiconductor laser mounting with intact diffusion barrier layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER