the principal constituent melting at a temperature of greater than 1550°C

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H01L2224/83463

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83463the principal constituent melting at a temperature of greater than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS