the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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H01L2224/05617

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05617the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for creating a bond between objects based on f...

Non-destructive testing of integrated circuit chips

Chip package and method for forming the same

Semiconductor device for use in flip-chip bonding, which reduces la...

Package systems

Package systems and manufacturing methods thereof

Transistor formation using cold welding

Package systems having an opening in a substrate thereof and manufa...

Transistor formation using cold welding

Package systems having a eutectic bonding material and manufacturin...

Light emitting device and method for manufacturing same

Semiconductor device having overload protection

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

CHIP-SCALE PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

TRANSISTOR FORMATION USING COLD WELDING

TRANSISTOR FORMATION USING COLD WELDING

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

Nitride-based semiconductor light-emitting device and method of man...