the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C

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CPC
H01L2924/17717

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/17717the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C

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Patents Grantslast 30 patents

Information Patent Grant
Quad flat non-leaded semiconductor package with wettable flank
- Patent number 9,324,637
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhigang Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents