the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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H01L2224/05117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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Patents Grantslast 30 patents

Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 10,351,418
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond rings in semiconductor devices and methods of forming same
- Patent number 9,957,156
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Rings in Semiconductor Devices and Methods of Forming Same
- Publication number 20180230003
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND RINGS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20170275153
- Publication date Sep 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride-based semiconductor light-emitting device and method of man...
- Publication number 20070051968
- Publication date Mar 8, 2007
- Shuichiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS