the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

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Semiconductor device

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Semiconductor packaging and manufacturing method thereof

Bump electrode, board which has bump electrodes, and method for man...

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Semiconductor device for use in flip-chip bonding, which reduces la...

Semiconductor packaging and manufacturing method thereof

Bonding apparatus and bonding method

Bonding apparatus

Methods of forming multi-chip semiconductor substrates

Patents Applicationslast 30 patents

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SEMICONDUCTOR DEVICE

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT