the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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H01L2224/13617

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13617the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection components with rows of lead bond sections
- Patent number 5,959,354
- Issue date Sep 28, 1999
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element bonding with deformation of leads in rows
- Patent number 5,830,782
- Issue date Nov 3, 1998
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic element bonding with deformation of leads in rows
- Publication number 20010000032
- Publication date Mar 15, 2001
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS