Membership
Tour
Register
Log in
the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C
Follow
Industry
CPC
H01L2924/15717
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/15717
the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Seed layer free nanoporous metal deposition for bonding
Patent number
10,566,214
Issue date
Feb 18, 2020
Facebook Technologies, LLC
John Michael Goward
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
Patent number
8,853,835
Issue date
Oct 7, 2014
Infineon Technologies AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
Publication number
20140097528
Publication date
Apr 10, 2014
INFINEON TECHNOLOGIES AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS