TREA

the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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  • CPC
  • H01L2224/45638
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45638the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240105668
    • Publication date Mar 28, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • H01 - BASIC ELECTRIC ELEMENTS