the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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CPC
H01L2224/81438

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81438the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents