TREA

the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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Industry

  • CPC
  • H01L2224/84438
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84438the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Clip and related methods
    • Patent number 10,121,763
    • Issue date Nov 6, 2018
    • Semiconductor Components Industries, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Clip and related methods
    • Patent number 9,911,712
    • Issue date Mar 6, 2018
    • Semiconductor Components Industries, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CLIP AND RELATED METHODS
    • Publication number 20180197836
    • Publication date Jul 12, 2018
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS