the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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H01L2224/48738

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48738the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having metal alloy for electrodes
- Patent number 6,011,305
- Issue date Jan 4, 2000
- NEC Corporation
- Kouichi Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS