the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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CPC
H01L2224/29338

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29338the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

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Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
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Information Patent Grant
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Information Patent Grant
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Information Patent Application
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the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Semiconductor packaging containing sintering die-attach material

Electrically conductive bonding material, method of bonding with th...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Semiconductor Package w...

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...