the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C

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H01L2924/17738

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/17738the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C

Industries

Patents Grantslast 30 patents

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Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Integrated circuit device with plating on lead interconnection poin...

Chip package and a wafer level package

Method for producing electronic device with multi-layer contact

Integrated circuit package for assembling various dice in a single...

Integrated circuit package for assembling various dice in a single...

Integrated circuit device with plating on lead interconnection poin...

Power module of square flat pin-free packaging structure

Encapsulating resin composition, semiconductor device using the enc...

Chip package and a wafer level package

Semiconductor device and method for manufacturing the same

Matrix lid heatspreader for flip chip package

Glass/ceramic replacement of epoxy for high temperature hermeticall...

Integrated circuit (IC) package with thick die pad functioning as a...

Semiconductor device and method for manufacturing the same

Molded flip-clip semiconductor package

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

Integrated Circuit Device with Plating on Lead Interconnection Poin...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

Integrated Circuit Package For Assembling Various Dice In A Single...

Electronic Device with Multi-Layer Contact

SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING...

ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENC...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT (IC) PACKAGE WITH THICK DIE PAD, AND ASSOCIATED...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

INTEGRATED CIRCUIT DEVICE WITH PLATING ON LEAD INTERCONNECTION POIN...

Matrix Lid Heatspreader for Flip Chip Package

Glass/Ceramic Replacement of Epoxy for High Temperature Hermeticall...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Matrix Lid Heatspreader for Flip Chip Package

A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...

GLASS/CERAMICS REPLACEMENT OF EPOXY FOR HIGH TEMPERATURE HERMETICAL...

SEMICONDUCTOR DEVEICE AND METHOD FOR MANUFACTURING THE SAME