the principal constituent melting at a temperature of less than 400 C

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H01L2924/15701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15701the principal constituent melting at a temperature of less than 400 C

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Information Patent Grant
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Information Patent Grant
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Patents Applicationslast 30 patents

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the principal constituent melting at a temperature of less than 400 C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low cost substrates

Semiconductor device and die bonding structure thereof

Chip arrangements, a chip package and a method for manufacturing a...

Underfill fluxing curative

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE...

SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...

PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE AND PRODUCTION METHOD FOR...

METHOD FOR PREPARING LOW COST SUBSTRATES

SEMICONDUCTOR PACKAGE

Lead-Free Solder Alloy

SEMICONDUCTOR DEVICE AND DIE BONDING STRUCTURE THEREOF

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Underfill fluxing curative