the principal constituent melting at a temperature of less than 400 C

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H01L2924/17701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/17701the principal constituent melting at a temperature of less than 400 C

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,601,415
- Issue date Mar 21, 2017
- Renesas Electronics Corporation
- Yasutomo Makino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20160254214
- Publication date Sep 1, 2016
- RENESAS ELECTRONICS CORPORATON
- Yasutomo Makino
- H01 - BASIC ELECTRIC ELEMENTS