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the principal constituent melting at a temperature of less than 400°C

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  • CPC
  • H01L2224/83701
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83701the principal constituent melting at a temperature of less than 400°C
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device
    • Patent number 8,217,403
    • Issue date Jul 10, 2012
    • Napra Co., Ltd
    • Shigenobu Sekine
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents