the principal constituent melting at a temperature of less than 400°C

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H01L2224/13601

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13601the principal constituent melting at a temperature of less than 400°C

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures for package and substrate
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- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
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- Issue date Dec 15, 2020
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
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- Issue date Apr 21, 2020
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,741,589
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,397,059
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,117,825
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 8,829,673
- Issue date Sep 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder on pad on fine pitch PCB and method of fli...
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- Issue date Aug 5, 2014
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electrostatic discharge protection using a...
- Patent number 7,629,202
- Issue date Dec 8, 2009
- International Business Machines Corporation
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20170345677
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20150371964
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20150262952
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140377946
- Publication date Dec 25, 2014
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20140159203
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20140048929
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...
- Publication number 20130334291
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METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
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- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures for package and substrate

Substrate pad structure

Substrate pad structure

Semiconductor device and method of forming SIP with electrical comp...

Bonded structures for package and substrate

Substrate pad structure

Bonded structures for package and substrate

Bonded structures for package and substrate

Substrate pad structure

Bonded structures for package and substrate

Method of forming solder on pad on fine pitch PCB and method of fli...

Method and apparatus for electrostatic discharge protection using a...

Patents Applicationslast 30 patents

Bonded Structures for Package and Substrate

Substrate Pad Structure

Bonded Structures for Package and Substrate

BUMP STRUCTURE AND METHOD FOR FORMING THE SAME

Bonded Structures for Package and Substrate

Substrate Pad Structure

Bonded Structures for Package and Substrate

METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLI...

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...