the principal constituent melting at a temperature of less than 400°C

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CPC
H01L2224/13401

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13401the principal constituent melting at a temperature of less than 400°C

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip QFN structure using etched lead frame
- Patent number 8,525,309
- Issue date Sep 3, 2013
- Tessera, Inc.
- Chok Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
- Publication number 20130001757
- Publication date Jan 3, 2013
- Tessera. Inc.
- Chok Chia
- H01 - BASIC ELECTRIC ELEMENTS