the principal constituent melting at a temperature of less than 400°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05601the principal constituent melting at a temperature of less than 400°C

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Patents Grantslast 30 patents

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Package structure and method for fabricating the same
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Method for assembling a microelectronic chip element on a wire elem...
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Pre-plated substrate for die attachment
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Information Patent Grant
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Information Patent Grant
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- Issue date Oct 20, 1998
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Information Patent Grant
Integrated circuit chip composite having a parylene coating
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Information Patent Grant
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METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
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METHOD FOR FABRICATING PACKAGE STRUCTURE
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PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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the principal constituent melting at a temperature of less than 400°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Method for fabricating package structure having encapsulate sensing...

Method and apparatus for creating a bond between objects based on f...

Package structure and method for fabricating the same

Method for assembling a microelectronic chip element on a wire elem...

Pre-plated substrate for die attachment

Semiconductor chip, semiconductor package and fabricating method th...

Semiconductor structure with low-melting-temperature conductive reg...

Integrated circuit packaging system with coupling features and meth...

Semiconductor device and fabricating method thereof

Circuit board surface structure

Process of making an integrated circuit chip composite

Integrated circuit chip composite having a parylene coating

Process of making an integrated circuit chip composite including pa...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD FOR FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...

CIRCUIT BOARD SURFACE STRUCTURE