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the principal constituent melting at a temperature of less than 400°C
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CPC
H01L2224/45301
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/45301
the principal constituent melting at a temperature of less than 400°C
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last 30 patents
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Patent Grant
Thermocompression apparatus and method for bonding electrical compo...
Patent number
12,308,340
Issue date
May 20, 2025
MB AUTOMATION GmbH & Co. KG
Benjamin Holzner
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents