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the principal constituent melting at a temperature of less than 400°C
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CPC
H01L2224/85501
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/85501
the principal constituent melting at a temperature of less than 400°C
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CPC
H01L2224/85501
